HDI 1+(4)+1 Board, with Min. Width/Spacing of 0.12/0.12mm

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layer count: 6

Finish thickness: 1.6±0.16mm

Min. width/spacing: 0.12/0.12mm

Via dia: laser blind via: 0.15mm, buried via: 0.3mm, TPH: 0.35mm

Surface finish: ENIG

Specialty: L1-2,L5-6: laser blind via; L2-5: buried via

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