HDI Multilayer PCB with 0.1/0.1mm Minimum Width/Spacing

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layer count: 10

Finish thickness: 1.0±0.1mm

Minimum width/spacing: 0.1/0.1mm

Via diameter:

Surface finish: ENIG + plating thick gold finger

Specialty:

Laser blind vias: 0.1mm

Buried vias: 0.2mm

PTH: 0.2mm

L1 - 2, L9 - 10: laser blind vias

L2 - 9: buried vias

Plating thick gold finger without plating tie bar

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