High-density Multilayer PCB with Four Layers, 0.3mm Diameter, ENIG Surface Finish

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layer count: four

Finish thickness: 1.2 ± 10%mm

Minimum width/spacing: 0.1mm

Minimum via diameter: 0.3mm

Surface finish: ENIG

Specialty:

L1-2
L3-4: laser blind via of 0.15mm
L2-3: buried via of 0.25mm

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L1-2

L3-4: laser blind via of 0.15mm

L2-3: buried via of 0.25mm

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