HDI PCB with 1.2 ± 0.2mm Finish Thickness and 10 Layers

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layer count: 10

Finish thickness: 1.2 ± 0.2mm

Minimum width/spacing: 0.1/0.1mm

Minimum via diameter: 0.25mm

Surface finish: ENIG + gold finger

Specialty:

Minimum BGA pad size 8mil, stack bia hole, resin plug via hole

L1-2, L2-3, L8-9

L9-10: laser blind via of 0.1mm

L3-8:buried via of 0.2mm

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