Shenzhen Sunshine Circuits Technology Co. Ltd
Shenzhen Sunshine Circuits Technology Co. Ltd
High-density Multilayer PCBs with 0.1/0.1mm Minimum Width/Spacing and 0.25mm Minimum Via Diameter
  • High-density Multilayer PCBs with 0.1/0.1mm Minimum Width/Spacing and 0.25mm Minimum Via Diameter
High-density Multilayer PCBs with 0.1/0.1mm Minimum Width/Spacing and 0.25mm Minimum Via Diameter

High-density Multilayer PCBs with 0.1/0.1mm Minimum Width/Spacing and 0.25mm Minimum Via Diameter

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Telegraphic Transfer in Advance (Advance TT, T/T)
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Basic Info
Basic Info
Payment Type: Telegraphic Transfer in Advance (Advance TT, T/T)
Product Description
Product Description
  • Layer count: 10
  • Finish thickness: 1.6 ± 0.16mm
  • Minimum width/spacing: 0.1/0.1mm
  • Minimum via diameter: 0.25mm
  • Surface finish: ENIG
  • Specialty: L1-2: laser blind via of 0.1mm, filled by plating
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