Blind & Buried Impedance HDINew

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Basic Info

Payment Type:	Telegraphic Transfer in Advance (Advance TT, T/T)

Product Description

Layer count: 8

Finish thickness: 1.0±10%mm

Min width/spacing: 0.10/0.10mm

Min. via dia.: 0.35mm

Surface finish: ENIG

Specialty: L1-2, L2-3, L6-7, L7-8: Laser blind 0.13mm via, filled by plating, L3-6: buried via filled by resin, L6-8: stacked vias

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