Shenzhen Keyou Circuit Technology Co. Ltd
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Shenzhen Keyou Circuit Technology Co. Ltd
Single-sided Copper PCB with 2oz Copper Thickness, 2.5 Board Thickness
  • Single-sided Copper PCB with 2oz Copper Thickness, 2.5 Board Thickness
  • Single-sided Copper PCB with 2oz Copper Thickness, 2.5 Board Thickness
  • Single-sided Copper PCB with 2oz Copper Thickness, 2.5 Board Thickness
  • Single-sided Copper PCB with 2oz Copper Thickness, 2.5 Board Thickness
Single-sided Copper PCB with 2oz Copper Thickness, 2.5 Board Thickness
Single-sided Copper PCB with 2oz Copper Thickness, 2.5 Board Thickness
Single-sided Copper PCB with 2oz Copper Thickness, 2.5 Board Thickness
Single-sided Copper PCB with 2oz Copper Thickness, 2.5 Board Thickness

Single-sided Copper PCB with 2oz Copper Thickness, 2.5 Board Thickness

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Basic Info
Basic Info
Payment Type: TT,LC,PAYPAL
Product Description
Product Description
  • Layer count: One layer
  • Major material: Copper
  • Board thickness: 2.5 mm
  • Surface finishing: Lead free HASL
  • Solder mask: White
  • Copper thickness: 2oz
  • Min hole size: 0.3mm
  • Min line width and spacing: 4mil
  • Manufacturer capability:
    • Material: FR-4/Hi Tg FR-4/lead free, (RoHS compliant)/CEM-3, aluminum, metal based
    • Layer numbers.:1~16
    • Finished board thickness: 0.2-3.5mm, (8-138 mil)
    • Board thickness tolerance: ±10%
    • Cooper thicknesses: 0.5-4OZ (18-144um)
    • Copper plating hole: 18-40um
    • Impedance control: ±10%
    • Warp & twist:  0.70% 
  • Image:
    • Min trace width (a):  0.075mm (3 mil)
    • Min space width (b):  0.075mm (3 mil)
    • SMD pitch (a): 0.2mm(8 mil)
    • BGA pitch (b):  0.2mm (8 mil)
  • Solder mask:
    • Min solder mask dam (a): 0.0635mm (2.5mil)
    • Soldermask clearance (b): 0.075mm (3 mil)
    • Min SMT pad spacing (c):  0.075mm (3 mil)
    • Solder mask thickness: 0.0007"(0.018mm)
  • Holes:
    • Min hole size (CNC): 0.2mm (8mil)
    • Min punch hole size: 0.9mm (35 mil)
    • Hole size tol (+/-): PTH: ±0.075mm, NPTH: ±0.05mm
    • Hole position tol:  ±0.075mm
  • Plating:
    • HASL/lead free HASL: 2.5um
    • Immersion gold nickel: 3-7um  Au:1-5u''
    • OSP: 0.2-0.5um
  • Certificates: RoHS, ISO9001:2008,  SGS and UL
  • Material: FR-4/Hi Tg FR-4/lead free, (RoHS compliant)/CEM-3, aluminum, metal based
  • Layer numbers.:1~16
  • Finished board thickness: 0.2-3.5mm, (8-138 mil)
  • Board thickness tolerance: ±10%
  • Cooper thicknesses: 0.5-4OZ (18-144um)
  • Copper plating hole: 18-40um
  • Impedance control: ±10%
  • Warp & twist:  0.70% 
  • Min trace width (a):  0.075mm (3 mil)
  • Min space width (b):  0.075mm (3 mil)
  • SMD pitch (a): 0.2mm(8 mil)
  • BGA pitch (b):  0.2mm (8 mil)
  • Min solder mask dam (a): 0.0635mm (2.5mil)
  • Soldermask clearance (b): 0.075mm (3 mil)
  • Min SMT pad spacing (c):  0.075mm (3 mil)
  • Solder mask thickness: 0.0007"(0.018mm)
  • Min hole size (CNC): 0.2mm (8mil)
  • Min punch hole size: 0.9mm (35 mil)
  • Hole size tol (+/-): PTH: ±0.075mm, NPTH: ±0.05mm
  • Hole position tol:  ±0.075mm
  • HASL/lead free HASL: 2.5um
  • Immersion gold nickel: 3-7um  Au:1-5u''
  • OSP: 0.2-0.5um

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