Impedance Controlled Rigid Flex PCB with 1.6mm Board Thickness

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Basic Info

Payment Type:	TT, LC, PayPal

Product Description

Specifications:

Layer count: 4 layers
Major material: FR4
Board thickness: 1.6mm
Surface finishing: lead-free
Solder mask: green
Copper thickness: 1oz
Minimum hole size: 0.3mm
Minimum line width and spacing: 4-mil

The following is the whole manufacturer capability:

Material: FR-4/Hi-Tg FR-4/lead-free
Materials (RoHS Directive-compliant)/CEM-3, aluminum, metal based
Layer No: 1-16
Finishing board thickness range: 0.2-3.5mm (8-138-mil)
Board thickness tolerance: ±10%
Cooper thickness range: 0.5-4oz (18-144um)
Copper plating hole: 18-40um
Impedance control: ±10%
Warp and twist: 0.70%

Image:

Minimum trace width: 0.075mm (3-mil)
Minimum space width: 0.075mm (3-mil)
SMD pitch: 0.2mm (8-mil)
BGA pitch: 0.2mm (8-mil)

Solder mask:

Minimum solder mask dam: 0.0635mm (2.5-mil)
Solder mask clearance: 0.075mm (3-mil)
Minimum SMT pad spacing: 0.075mm (3-mil)
Solder mask thickness: 0.0007-inch (0.018mm)

Holes:

Minimum hole size (CNC): 0.2mm (8-mil)
Minimum punch hole size: 0.9mm (35-mil)
Hole size tol:
- PTH: ±0.075mm
- NPTH: ±0.05mm
Hole position tol: ±0.075mm

Plating:

HASL/lead-free HASL: 2.5um
Immersion gold nickel: 3-7um Au: 1-5u-inch
OSP: 0.2-0.5um

With RoHS, SGS, UL marks

Layer count: 4 layers

Major material: FR4

Board thickness: 1.6mm

Surface finishing: lead-free

Solder mask: green

Copper thickness: 1oz

Minimum hole size: 0.3mm

Minimum line width and spacing: 4-mil

Material: FR-4/Hi-Tg FR-4/lead-free

Materials (RoHS Directive-compliant)/CEM-3, aluminum, metal based

Layer No: 1-16

Finishing board thickness range: 0.2-3.5mm (8-138-mil)

Board thickness tolerance: ±10%

Cooper thickness range: 0.5-4oz (18-144um)

Copper plating hole: 18-40um

Impedance control: ±10%

Warp and twist: 0.70%

Minimum trace width: 0.075mm (3-mil)

Minimum space width: 0.075mm (3-mil)

SMD pitch: 0.2mm (8-mil)

BGA pitch: 0.2mm (8-mil)

Minimum solder mask dam: 0.0635mm (2.5-mil)

Solder mask clearance: 0.075mm (3-mil)

Minimum SMT pad spacing: 0.075mm (3-mil)

Solder mask thickness: 0.0007-inch (0.018mm)

Minimum hole size (CNC): 0.2mm (8-mil)

Minimum punch hole size: 0.9mm (35-mil)

Hole size tol:

PTH: ±0.075mm
NPTH: ±0.05mm

Hole position tol: ±0.075mm

PTH: ±0.075mm

NPTH: ±0.05mm

HASL/lead-free HASL: 2.5um

Immersion gold nickel: 3-7um Au: 1-5u-inch

OSP: 0.2-0.5um

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