Shenzhen Keyou Circuit Technology Co. Ltd
Shenzhen Keyou Circuit Technology Co. Ltd
UPS Multilayer PCB, Shenzhen Supplier with RoHS, SGS, UL Marks
  • UPS Multilayer PCB, Shenzhen Supplier with RoHS, SGS, UL Marks
UPS Multilayer PCB, Shenzhen Supplier with RoHS, SGS, UL Marks

UPS Multilayer PCB, Shenzhen Supplier with RoHS, SGS, UL Marks

Payment Type:
T/T, L/C, PayPal
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Payment Type: T/T, L/C, PayPal
Product Description
Product Description
  • Specifications:
    • Layers: 6
    • Major material: FR4
    • Board thickness: 1.6mm
    • Surface finishing: lead-free
    • Solder mask: green
    • Copper thickness: 1oz
    • Minimum hole size: 0.3mm
    • Minimum line width and spacing: 4-mil
    • Material: FR4/Hi Tg FR4/lead-free (RoHS mark)/CEM-3, aluminum, metal based
    • Layers: 1-16
    • Finishing board thicknesses: 0.2-3.5mm (8-138-mil)
    • Board thickness tolerance: ±10%
    • Copper thickness: 0.5-4oz (18-144um)
    • Copper plating hole: 18-40um
    • Impedance control: ±10%
    • Warp and twist: 0.70%
    • Image:
      • BGA pitch (b): 0.2mm (8-mil)
      • SMD pitch (a): 0.2mm (8-mil)
      • Minimum space width (b): 0.075mm (3-mil)
      • Minimum trace width (a): 0.075mm (3-mil)
    • Solder mask:
      • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
      • Solder mask clearance (b): 0.075mm (3-mil)
      • Minimum SMT pad spacing (c): 0.075mm (3-mil)
      • Solder mask thickness: 0.0007-inch (0.018mm)
    • Holes:
      • Minimum hole size (CNC): 0.2mm (8-mil)
      • Minimum punch hole size: 0.9mm (35-mil)
      • Hole size tolerance:
        • PTH: ±0.075mm
        • NPTH: ±0.05mm
      • Hole position tolerance: ±0.075mm
    • Plating:
      • HASL/lead-free HASL: 2.5um
      • Immersion gold nickel: 3-7um Au: 1-5u-inch
      • OSP: 0.2-0.5um
      • Certificates: RoHS, SGS, UL
  • Layers: 6
  • Major material: FR4
  • Board thickness: 1.6mm
  • Surface finishing: lead-free
  • Solder mask: green
  • Copper thickness: 1oz
  • Minimum hole size: 0.3mm
  • Minimum line width and spacing: 4-mil
  • Material: FR4/Hi Tg FR4/lead-free (RoHS mark)/CEM-3, aluminum, metal based
  • Layers: 1-16
  • Finishing board thicknesses: 0.2-3.5mm (8-138-mil)
  • Board thickness tolerance: ±10%
  • Copper thickness: 0.5-4oz (18-144um)
  • Copper plating hole: 18-40um
  • Impedance control: ±10%
  • Warp and twist: 0.70%
  • Image:
    • BGA pitch (b): 0.2mm (8-mil)
    • SMD pitch (a): 0.2mm (8-mil)
    • Minimum space width (b): 0.075mm (3-mil)
    • Minimum trace width (a): 0.075mm (3-mil)
  • Solder mask:
    • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
    • Solder mask clearance (b): 0.075mm (3-mil)
    • Minimum SMT pad spacing (c): 0.075mm (3-mil)
    • Solder mask thickness: 0.0007-inch (0.018mm)
  • Holes:
    • Minimum hole size (CNC): 0.2mm (8-mil)
    • Minimum punch hole size: 0.9mm (35-mil)
    • Hole size tolerance:
      • PTH: ±0.075mm
      • NPTH: ±0.05mm
    • Hole position tolerance: ±0.075mm
  • Plating:
    • HASL/lead-free HASL: 2.5um
    • Immersion gold nickel: 3-7um Au: 1-5u-inch
    • OSP: 0.2-0.5um
    • Certificates: RoHS, SGS, UL
  • BGA pitch (b): 0.2mm (8-mil)
  • SMD pitch (a): 0.2mm (8-mil)
  • Minimum space width (b): 0.075mm (3-mil)
  • Minimum trace width (a): 0.075mm (3-mil)
  • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
  • Solder mask clearance (b): 0.075mm (3-mil)
  • Minimum SMT pad spacing (c): 0.075mm (3-mil)
  • Solder mask thickness: 0.0007-inch (0.018mm)
  • Minimum hole size (CNC): 0.2mm (8-mil)
  • Minimum punch hole size: 0.9mm (35-mil)
  • Hole size tolerance:
    • PTH: ±0.075mm
    • NPTH: ±0.05mm
  • Hole position tolerance: ±0.075mm
  • PTH: ±0.075mm
  • NPTH: ±0.05mm
  • HASL/lead-free HASL: 2.5um
  • Immersion gold nickel: 3-7um Au: 1-5u-inch
  • OSP: 0.2-0.5um
  • Certificates: RoHS, SGS, UL
  • Send your message to this supplier

    • Ms.  Cheng

    • Enter between 20 to 4,000 characters.

    Related Keywords

    Related Keywords