1oz Copper Thickness Multilayer PCB for IP

1oz Copper Thickness Multilayer PCB for IP

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Basic Info

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Product Description

Layers: 4

Major material: FR4

Board thickness: 1.6mm

Surface finishing: immersion gold

Solder mask: green

Copper thickness: 1oz

Minimum hole size: 0.3mm

Minimum line width and spacing: 4-mil

Materials: FR4/Hi Tg FR4/lead-free (RoHS mark)/CEM-3, aluminum, metal based

Layers: 1-16

Finishing board thickness: 0.2-3.5mm (8-138-mil)

Board thickness tolerance: ±10%

Copper thickness: 0.5-4oz (18-144um)

Copper plating hole: 18-40um

Impedance control: ±10%

Warp and twist: 0.70%

Image:

BGA pitch (b): 0.2mm (8-mil)
SMD pitch (a): 0.2mm (8-mil)
Minimum space width (b): 0.075mm (3-mil)
Minimum trace width (a): 0.075mm (3-mil)

Solder mask:

Minimum solder mask dam (a): 0.0635mm (2.5-mil)
Solder mask clearance (b): 0.075mm (3-mil)
Minimum SMT pad spacing (c): 0.075mm (3-mil)
Solder mask thickness: 0.0007-inch (0.018mm)

Holes:

Minimum hole size (CNC): 0.2mm (8-mil)
Minimum punch hole size: 0.9mm (35-mil)

Hole size tolerance:

PTH: ±0.075mm
NPTH: ±0.05mm
Hole position tolerance: ±0.075mm

Plating:

HASL/lead-free HASL: 2.5um
Immersion gold nickel: 3-7um Au: 1-5u"
OSP: 0.2-0.5um

Certificates: RoHS, SGS, UL

BGA pitch (b): 0.2mm (8-mil)

SMD pitch (a): 0.2mm (8-mil)

Minimum space width (b): 0.075mm (3-mil)

Minimum trace width (a): 0.075mm (3-mil)

Minimum solder mask dam (a): 0.0635mm (2.5-mil)

Solder mask clearance (b): 0.075mm (3-mil)

Minimum SMT pad spacing (c): 0.075mm (3-mil)

Solder mask thickness: 0.0007-inch (0.018mm)

Minimum hole size (CNC): 0.2mm (8-mil)

Minimum punch hole size: 0.9mm (35-mil)

PTH: ±0.075mm

NPTH: ±0.05mm

Hole position tolerance: ±0.075mm

HASL/lead-free HASL: 2.5um

Immersion gold nickel: 3-7um Au: 1-5u"

OSP: 0.2-0.5um

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