Shenzhen Keyou Circuit Technology Co. Ltd
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Shenzhen Keyou Circuit Technology Co. Ltd
Multilayer Precision LED PCB, in China, 1.6mm Board Thickness
  • Multilayer Precision LED PCB, in China, 1.6mm Board Thickness
Multilayer Precision LED PCB, in China, 1.6mm Board Thickness
Multilayer Precision LED PCB, in China, 1.6mm Board Thickness
Multilayer Precision LED PCB, in China, 1.6mm Board Thickness

Multilayer Precision LED PCB, in China, 1.6mm Board Thickness

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Basic Info
Basic Info
Payment Type: T/T, L/C, PayPal
Product Description
Product Description
  • Features:
    • Layer count: 4 layers
    • Major material: FR4
    • Board thickness: 1.6mm
    • Surface finishing: immersion gold
    • Solder mask: green
    • Copper thickness: 1oz
    • Minimum hole size: 0.3mm
    • Minimum line width and spacing: 4-mil
  • The following is the whole manufacturer capacibility:
    • Item:
      • Materials: FR-4/Hi-Tg FR-4/lead-free/CEM-3, aluminum, metal based
      • Layer no: 1-16
      • Finished board thickness: 0.2-3.5mm (8-138-mil)
      • Board thickness tolerance: ±10%
      • Copper thickness: 0.5-4oz (18-144um)
      • Copper plating hole: 18-40um
      • Impedance control: ±10%
      • Warp and twist: 0.70% 
    • Image:
      • Minimum trace width (a): 0.075mm (3-mil)
      • Minimum space width (b): 0.075mm (3-mil)     
      • SMD pitch (a): 0.2mm (8-mil)
      • BGA pitch (b): 0.2mm (8-mil)
    • Solder mask:
      • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
      • Solder mask clearance (b): 0.075mm (3-mil)
      • Minimum SMT pad spacing (c): 0.075mm (3-mil)
      • Solder mask thickness: 0.0007-inch (0.018mm)
    • Holes:        
      • Minimum size (CNC): 0.2mm (8-mil)
      • Min punch hole size: 0.9mm (35-mil)
      • Hole size (+/-):
        • PTH: ±0.075mm
        • NPTH: ±0.05mm
      • Hole position: ±0.075mm
    • Plating:
      • HASL/lead-free HASL: 2.5um
      • Immersion gold nickel: 3-7um Au: 1-5u-inch
      • OSP: 0.2-0.5um
      • Certificates: RoHS, SGS, UL 
      • Axial flat top view amber Chip LED component, 1.40nm height subminiature
  • Layer count: 4 layers
  • Major material: FR4
  • Board thickness: 1.6mm
  • Surface finishing: immersion gold
  • Solder mask: green
  • Copper thickness: 1oz
  • Minimum hole size: 0.3mm
  • Minimum line width and spacing: 4-mil
  • Item:
    • Materials: FR-4/Hi-Tg FR-4/lead-free/CEM-3, aluminum, metal based
    • Layer no: 1-16
    • Finished board thickness: 0.2-3.5mm (8-138-mil)
    • Board thickness tolerance: ±10%
    • Copper thickness: 0.5-4oz (18-144um)
    • Copper plating hole: 18-40um
    • Impedance control: ±10%
    • Warp and twist: 0.70% 
  • Image:
    • Minimum trace width (a): 0.075mm (3-mil)
    • Minimum space width (b): 0.075mm (3-mil)     
    • SMD pitch (a): 0.2mm (8-mil)
    • BGA pitch (b): 0.2mm (8-mil)
  • Solder mask:
    • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
    • Solder mask clearance (b): 0.075mm (3-mil)
    • Minimum SMT pad spacing (c): 0.075mm (3-mil)
    • Solder mask thickness: 0.0007-inch (0.018mm)
  • Holes:        
    • Minimum size (CNC): 0.2mm (8-mil)
    • Min punch hole size: 0.9mm (35-mil)
    • Hole size (+/-):
      • PTH: ±0.075mm
      • NPTH: ±0.05mm
    • Hole position: ±0.075mm
  • Plating:
    • HASL/lead-free HASL: 2.5um
    • Immersion gold nickel: 3-7um Au: 1-5u-inch
    • OSP: 0.2-0.5um
    • Certificates: RoHS, SGS, UL 
    • Axial flat top view amber Chip LED component, 1.40nm height subminiature
  • Materials: FR-4/Hi-Tg FR-4/lead-free/CEM-3, aluminum, metal based
  • Layer no: 1-16
  • Finished board thickness: 0.2-3.5mm (8-138-mil)
  • Board thickness tolerance: ±10%
  • Copper thickness: 0.5-4oz (18-144um)
  • Copper plating hole: 18-40um
  • Impedance control: ±10%
  • Warp and twist: 0.70% 
  • Minimum trace width (a): 0.075mm (3-mil)
  • Minimum space width (b): 0.075mm (3-mil)     
  • SMD pitch (a): 0.2mm (8-mil)
  • BGA pitch (b): 0.2mm (8-mil)
  • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
  • Solder mask clearance (b): 0.075mm (3-mil)
  • Minimum SMT pad spacing (c): 0.075mm (3-mil)
  • Solder mask thickness: 0.0007-inch (0.018mm)
  • Minimum size (CNC): 0.2mm (8-mil)
  • Min punch hole size: 0.9mm (35-mil)
  • Hole size (+/-):
    • PTH: ±0.075mm
    • NPTH: ±0.05mm
  • Hole position: ±0.075mm
  • PTH: ±0.075mm
  • NPTH: ±0.05mm
  • HASL/lead-free HASL: 2.5um
  • Immersion gold nickel: 3-7um Au: 1-5u-inch
  • OSP: 0.2-0.5um
  • Certificates: RoHS, SGS, UL 
  • Axial flat top view amber Chip LED component, 1.40nm height subminiature

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