Shenzhen Keyou Circuit Technology Co. Ltd
Products
Products
Shenzhen Keyou Circuit Technology Co. Ltd
Multilayer PCB Circuits Manufacturing and Assembly, Made of FR-4 Material, 1.5mm Thickness
  • Multilayer PCB Circuits Manufacturing and Assembly, Made of FR-4 Material, 1.5mm Thickness
  • Multilayer PCB Circuits Manufacturing and Assembly, Made of FR-4 Material, 1.5mm Thickness
Multilayer PCB Circuits Manufacturing and Assembly, Made of FR-4 Material, 1.5mm Thickness
Multilayer PCB Circuits Manufacturing and Assembly, Made of FR-4 Material, 1.5mm Thickness

Multilayer PCB Circuits Manufacturing and Assembly, Made of FR-4 Material, 1.5mm Thickness

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Basic Info
Basic Info
Payment Type: L/C, T/T or PayPal
Product Description
Product Description
  • Specifications:
    • Layers: 6L
    • Material: FR-4
    • Thickness: 1.5mm
    • Cu thickness: 35/35Um
    • Surface finishing: Immersion gold
    • Solder mask: green
    • Silk screen: white
    • Outline: routing
    • Testing: flying probe or test fixture
  • The following is the whole manufacturer capability:
    • Item material: FR-4/Hi Tg FR-4/lead free
    • Materials (RoHS Compliant)/CEM-3, aluminum, metal based
    • Layer no: 1-16
    • Finished board thickness: 0.2-3.5mm (8-138 mil)
    • Board thickness tolerance: ±10%
    • Cooper thickness: 0.5-4oz (18-144um)
    • Copper plating hole: 18-40um
    • Impedance control: ±10%
    • Warp and twist: 0.70% 
    • Image:
      • Minimum trace width (a): 0.075mm (3 mil)
      • Minimum space width (b): 0.075mm (3 mil)
      • SMD pitch (a): 0.2 mm (8 mil)
      • BGA pitch (b): 0.2 mm (8 mil)
    • Solder mask:
      • Minimum solder mask dam (a): 0.0635mm (2.5mil)
      • Solder mask clearance (b): 0.075mm (3 mil)
      • Minimum SMT pad spacing (c): 0.075mm (3 mil)
      • Solder mask thickness: 0.0007-inch (0.018mm)
    • Holes:
      • Minimum hole size (CNC): 0.2mm (8 mil)
      • Minimum punch hole size: 0.9mm (35 mil)
      • Hole size tol (+/-):
        • PTH: ±0.075mm
        • NPTH: ±0.05mm
      • Hole position tol: ±0.075mm
    • Plating:
      • HASL/lead free HASL: 2.5um
      • Immersion gold nickel: 3-7um
      • Au: 1-5u-inch
      • OSP: 0.2-0.5um
    • Certificates: RoHS, SGS, UL
  • Layers: 6L
  • Material: FR-4
  • Thickness: 1.5mm
  • Cu thickness: 35/35Um
  • Surface finishing: Immersion gold
  • Solder mask: green
  • Silk screen: white
  • Outline: routing
  • Testing: flying probe or test fixture
  • Item material: FR-4/Hi Tg FR-4/lead free
  • Materials (RoHS Compliant)/CEM-3, aluminum, metal based
  • Layer no: 1-16
  • Finished board thickness: 0.2-3.5mm (8-138 mil)
  • Board thickness tolerance: ±10%
  • Cooper thickness: 0.5-4oz (18-144um)
  • Copper plating hole: 18-40um
  • Impedance control: ±10%
  • Warp and twist: 0.70% 
  • Image:
    • Minimum trace width (a): 0.075mm (3 mil)
    • Minimum space width (b): 0.075mm (3 mil)
    • SMD pitch (a): 0.2 mm (8 mil)
    • BGA pitch (b): 0.2 mm (8 mil)
  • Solder mask:
    • Minimum solder mask dam (a): 0.0635mm (2.5mil)
    • Solder mask clearance (b): 0.075mm (3 mil)
    • Minimum SMT pad spacing (c): 0.075mm (3 mil)
    • Solder mask thickness: 0.0007-inch (0.018mm)
  • Holes:
    • Minimum hole size (CNC): 0.2mm (8 mil)
    • Minimum punch hole size: 0.9mm (35 mil)
    • Hole size tol (+/-):
      • PTH: ±0.075mm
      • NPTH: ±0.05mm
    • Hole position tol: ±0.075mm
  • Plating:
    • HASL/lead free HASL: 2.5um
    • Immersion gold nickel: 3-7um
    • Au: 1-5u-inch
    • OSP: 0.2-0.5um
  • Certificates: RoHS, SGS, UL
  • Minimum trace width (a): 0.075mm (3 mil)
  • Minimum space width (b): 0.075mm (3 mil)
  • SMD pitch (a): 0.2 mm (8 mil)
  • BGA pitch (b): 0.2 mm (8 mil)
  • Minimum solder mask dam (a): 0.0635mm (2.5mil)
  • Solder mask clearance (b): 0.075mm (3 mil)
  • Minimum SMT pad spacing (c): 0.075mm (3 mil)
  • Solder mask thickness: 0.0007-inch (0.018mm)
  • Minimum hole size (CNC): 0.2mm (8 mil)
  • Minimum punch hole size: 0.9mm (35 mil)
  • Hole size tol (+/-):
    • PTH: ±0.075mm
    • NPTH: ±0.05mm
  • Hole position tol: ±0.075mm
  • PTH: ±0.075mm
  • NPTH: ±0.05mm
  • HASL/lead free HASL: 2.5um
  • Immersion gold nickel: 3-7um
  • Au: 1-5u-inch
  • OSP: 0.2-0.5um

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