Shenzhen Keyou Circuit Technology Co. Ltd
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Shenzhen Keyou Circuit Technology Co. Ltd
Multi-layer HDI PCB, Supplier with Blind and Buried Vias, 0.2-3.2mm Board Thickness
  • Multi-layer HDI PCB, Supplier with Blind and Buried Vias, 0.2-3.2mm Board Thickness
  • Multi-layer HDI PCB, Supplier with Blind and Buried Vias, 0.2-3.2mm Board Thickness
  • Multi-layer HDI PCB, Supplier with Blind and Buried Vias, 0.2-3.2mm Board Thickness
Multi-layer HDI PCB, Supplier with Blind and Buried Vias, 0.2-3.2mm Board Thickness
Multi-layer HDI PCB, Supplier with Blind and Buried Vias, 0.2-3.2mm Board Thickness
Multi-layer HDI PCB, Supplier with Blind and Buried Vias, 0.2-3.2mm Board Thickness

Multi-layer HDI PCB, Supplier with Blind and Buried Vias, 0.2-3.2mm Board Thickness

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Basic Info
Basic Info
Payment Type: T/T, PayPal
Product Description
Product Description
  • Layer count: 4/6/8 layers or more
  • Flammability: 94V-0
  • Major material: FR-4/aluminum/copper board basis
  • Board thickness: 0.2-3.2mm
  • Surface finishing: immersion gold/tin/silver, HAL lead-free, OSP
  • Solder mask: green, black, white, blue, yellow, red and more
  • Solder mask hardness: 6H
  • Minimum solder mask dam: 0.075mm
  • Word colors: white, black, yellow, green and more
  • Finishing copper thickness: 0.5-4oz
  • Minimum hole size: 0.2mm
  • Minimum line width and spacing: 100um (4-mil)
  • MOQ: 50-100 square meters
  • Package: vacuum packing, master carton
  • Impedance control: ±8%
  • Flying probe test/fixture test for every single products, to make sure 100% pass

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