
Multilayer PCB Assembly for The US Market
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- Telegraphic Transfer (TT, T/T)
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Contact NowBasic Info
Basic Info
Payment Type: | Telegraphic Transfer (TT,T/T) |
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Product Description
Product Description
- Minimum hole diameter:
- Finish copper thickness: 1oz
- Surface finish: ENIG/lead-free
- Soldermask: blue/green
- Minimum line width/spacing: 0.075/0.075mm
- Minimum soldermask dam: 0.075mm
- Minimum and maximum board thickness: 0.2-3.5mm
- Maximum finish copper thickness: 0.5-4oz
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