Multilayer 6L Impedance BGA 1.2mm PCB, Blind and Buried Via

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Basic Info

Payment Type:	Telegraphic Transfer (TT,T/T)

Product Description

Layer count: 6

Finishing thickness: 1.575 ±10%mm

Minimum width/spacing: 4/4-mil

Minimum via diameter: 0.2mm

Surface finishing: lead-free HASL

Specialty: all VIA are filled with copper paste

Board thickness: 1.2mm

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