Shenzhen Keyou Circuit Technology Co. Ltd
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Shenzhen Keyou Circuit Technology Co. Ltd
Printed Circuit Manufacture China PCB with 1.6mm Board Thickness, Green Solder Mask
  • Printed Circuit Manufacture China PCB with 1.6mm Board Thickness, Green Solder Mask
Printed Circuit Manufacture China PCB with 1.6mm Board Thickness, Green Solder Mask

Printed Circuit Manufacture China PCB with 1.6mm Board Thickness, Green Solder Mask

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Basic Info
Basic Info
Payment Type: T/T, L/C, PayPal
Product Description
Product Description
  • Specifications:
    • Layers: 3
    • Major material: FR4
    • Board thickness: 1.6mm
    • Surface finishing: lead-free
    • Solder mask: green
    • Copper thickness: 1oz
    • Minimum hole size: 0.3mm
    • Minimum line width and spacing: 4-mil
  • The following is the whole manufacturer capacibility:
    • Material: FR4/Hi Tg FR4/lead-free (RoHS mark)/CEM-3, aluminum, metal based
    • Layers: 1-16
    • Finishing board thickness: 0.2-3.5mm (8-138-mil)
    • Board thickness tolerance: ±10%
    • Copper thickness: 0.5-4oz (18-144um)
    • Copper plating hole: 18-40um
    • Impedance control: ±10%
    • Warp and twist: 0.70%
    • Image:
      • Minimum trace width (a): 0.075mm (3-mil)
      • Minimum space width (b): 0.075mm (3-mil)
      • SMD pitch (a): 0.2mm (8-mil)
      • BGA pitch (b): 0.2mm (8-mil)
    • Solder mask:
      • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
      • Solder mask clearance (b): 0.075mm (3-mil)
      • Minimum SMT pad spacing (c): 0.075mm (3-mil)
      • Solder mask thickness: 0.0007-inch (0.018mm)
    • Holes:
      • Minimum hole size (CNC): 0.2mm (8-mil)
      • Minimum punch hole size: 0.9mm (35-mil)
      • Hole size tolerance:
        • PTH: ±0.075mm
        • NPTH: ±0.05mm
      • Hole position tolerance: ±0.075mm
    • Plating:
      • HASL/lead-free HASL: 2.5um
      • Immersion gold nickel: 3-7um Au: 1-5u-inch
      • OSP: 0.2-0.5um
    • Certificates: RoHS, SGS, UL
  • Layers: 3
  • Major material: FR4
  • Board thickness: 1.6mm
  • Surface finishing: lead-free
  • Solder mask: green
  • Copper thickness: 1oz
  • Minimum hole size: 0.3mm
  • Minimum line width and spacing: 4-mil
  • Material: FR4/Hi Tg FR4/lead-free (RoHS mark)/CEM-3, aluminum, metal based
  • Layers: 1-16
  • Finishing board thickness: 0.2-3.5mm (8-138-mil)
  • Board thickness tolerance: ±10%
  • Copper thickness: 0.5-4oz (18-144um)
  • Copper plating hole: 18-40um
  • Impedance control: ±10%
  • Warp and twist: 0.70%
  • Image:
    • Minimum trace width (a): 0.075mm (3-mil)
    • Minimum space width (b): 0.075mm (3-mil)
    • SMD pitch (a): 0.2mm (8-mil)
    • BGA pitch (b): 0.2mm (8-mil)
  • Solder mask:
    • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
    • Solder mask clearance (b): 0.075mm (3-mil)
    • Minimum SMT pad spacing (c): 0.075mm (3-mil)
    • Solder mask thickness: 0.0007-inch (0.018mm)
  • Holes:
    • Minimum hole size (CNC): 0.2mm (8-mil)
    • Minimum punch hole size: 0.9mm (35-mil)
    • Hole size tolerance:
      • PTH: ±0.075mm
      • NPTH: ±0.05mm
    • Hole position tolerance: ±0.075mm
  • Plating:
    • HASL/lead-free HASL: 2.5um
    • Immersion gold nickel: 3-7um Au: 1-5u-inch
    • OSP: 0.2-0.5um
  • Certificates: RoHS, SGS, UL
  • Minimum trace width (a): 0.075mm (3-mil)
  • Minimum space width (b): 0.075mm (3-mil)
  • SMD pitch (a): 0.2mm (8-mil)
  • BGA pitch (b): 0.2mm (8-mil)
  • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
  • Solder mask clearance (b): 0.075mm (3-mil)
  • Minimum SMT pad spacing (c): 0.075mm (3-mil)
  • Solder mask thickness: 0.0007-inch (0.018mm)
  • Minimum hole size (CNC): 0.2mm (8-mil)
  • Minimum punch hole size: 0.9mm (35-mil)
  • Hole size tolerance:
    • PTH: ±0.075mm
    • NPTH: ±0.05mm
  • Hole position tolerance: ±0.075mm
  • PTH: ±0.075mm
  • NPTH: ±0.05mm
  • HASL/lead-free HASL: 2.5um
  • Immersion gold nickel: 3-7um Au: 1-5u-inch
  • OSP: 0.2-0.5um

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