Shenzhen Keyou Circuit Technology Co. Ltd
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Shenzhen Keyou Circuit Technology Co. Ltd
Immersion Gold Multilayer PCB
  • Immersion Gold Multilayer PCB
Immersion Gold Multilayer PCB

Immersion Gold Multilayer PCB

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Basic Info
Basic Info
Payment Type: TT, LC, PayPal
Product Description
Product Description
  • Specifications:
    • Layers: 6
    • Major material: FR4
    • Board thickness: 1.6mm
    • Surface finishing: immersion gold
    • Solder mask: green
    • Copper thickness: 1oz
    • Minimum hole size: 0.3mm
    • Minimum line width and spacing: 4-mil
  • The following is the whole manufacturer capability:
    • Materials: FR4/Hi Tg FR4/lead-free (RoHS mark)/CEM-3, aluminum, metal based
    • Layers: 1-16
    • Finishing board thickness: 0.2-3.5mm (8-138-mil)
    • Board thickness tolerance: ±10%
    • Copper thickness: 0.5-4oz (18-144um)
    • Copper plating hole: 18-40um
    • Impedance control: ±10% Ω
    • Warp and twist: 0.70%
    • Image:
      • Minimum trace width (a): 0.075mm (3-mil)
      • Minimum space width (b): 0.075mm (3-mil)
      • SMD pitch (a): 0.2mm (8-mil)
      • BGA pitch (b): 0.2mm (8-mil)
    • Solder mask:
      • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
      • Solder mask clearance (b): 0.075mm (3-mil)
      • Minimum SMT pad spacing (c): 0.075mm (3-mil)
      • Solder mask thickness: 0.0007-inch (0.018mm)
    • Holes:
      • Minimum hole size (CNC): 0.2mm (8-mil)
      • Minimum punch hole size: 0.9mm (35-mil)
      • Hole size tolerance:
        • PTH: ±0.075mm
        • NPTH: ±0.05mm
      • Hole position tolerance: ±0.075mm
    • Plating:
      • HASL/lead-free HASL: 2.5um
      • Immersion gold nickel: 3-7um Au: 1-5u
      • OSP: 0.2-0.5um
    • Certificates: RoHS, SGS, UL
  • Layers: 6
  • Major material: FR4
  • Board thickness: 1.6mm
  • Surface finishing: immersion gold
  • Solder mask: green
  • Copper thickness: 1oz
  • Minimum hole size: 0.3mm
  • Minimum line width and spacing: 4-mil
  • Materials: FR4/Hi Tg FR4/lead-free (RoHS mark)/CEM-3, aluminum, metal based
  • Layers: 1-16
  • Finishing board thickness: 0.2-3.5mm (8-138-mil)
  • Board thickness tolerance: ±10%
  • Copper thickness: 0.5-4oz (18-144um)
  • Copper plating hole: 18-40um
  • Impedance control: ±10% Ω
  • Warp and twist: 0.70%
  • Image:
    • Minimum trace width (a): 0.075mm (3-mil)
    • Minimum space width (b): 0.075mm (3-mil)
    • SMD pitch (a): 0.2mm (8-mil)
    • BGA pitch (b): 0.2mm (8-mil)
  • Solder mask:
    • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
    • Solder mask clearance (b): 0.075mm (3-mil)
    • Minimum SMT pad spacing (c): 0.075mm (3-mil)
    • Solder mask thickness: 0.0007-inch (0.018mm)
  • Holes:
    • Minimum hole size (CNC): 0.2mm (8-mil)
    • Minimum punch hole size: 0.9mm (35-mil)
    • Hole size tolerance:
      • PTH: ±0.075mm
      • NPTH: ±0.05mm
    • Hole position tolerance: ±0.075mm
  • Plating:
    • HASL/lead-free HASL: 2.5um
    • Immersion gold nickel: 3-7um Au: 1-5u
    • OSP: 0.2-0.5um
  • Certificates: RoHS, SGS, UL
  • Minimum trace width (a): 0.075mm (3-mil)
  • Minimum space width (b): 0.075mm (3-mil)
  • SMD pitch (a): 0.2mm (8-mil)
  • BGA pitch (b): 0.2mm (8-mil)
  • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
  • Solder mask clearance (b): 0.075mm (3-mil)
  • Minimum SMT pad spacing (c): 0.075mm (3-mil)
  • Solder mask thickness: 0.0007-inch (0.018mm)
  • Minimum hole size (CNC): 0.2mm (8-mil)
  • Minimum punch hole size: 0.9mm (35-mil)
  • Hole size tolerance:
    • PTH: ±0.075mm
    • NPTH: ±0.05mm
  • Hole position tolerance: ±0.075mm
  • PTH: ±0.075mm
  • NPTH: ±0.05mm
  • HASL/lead-free HASL: 2.5um
  • Immersion gold nickel: 3-7um Au: 1-5u
  • OSP: 0.2-0.5um

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