Shenzhen Keyou Circuit Technology Co. Ltd
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Products
Shenzhen Keyou Circuit Technology Co. Ltd
BGA 4 Layers Printed Wire Board for Digital Cameras, 1.0mm Thickness, 35/35um Cu Thickness
  • BGA 4 Layers Printed Wire Board for Digital Cameras, 1.0mm Thickness, 35/35um Cu Thickness
BGA 4 Layers Printed Wire Board for Digital Cameras, 1.0mm Thickness, 35/35um Cu Thickness

BGA 4 Layers Printed Wire Board for Digital Cameras, 1.0mm Thickness, 35/35um Cu Thickness

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Basic Info
Basic Info
Payment Type: TT, LC, PayPal
Product Description
Product Description
  • Specification:
    • Layers: 4 
    • Material: FR4
    • Thickness: 1.0mm
    • Cu thickness: 35/35um
    • Surface finishing: BGA
    • Solder mask: green
    • Silkscreen: white 
    • Outline: routing
    • Testing: flying Probe or test fixture
  • Materials that we keep in stock are:
    • FR4 (Tg – 135C, 145C, 170C)
    • Rogers ultralam 2000
    • Rogers RO4350
    • Rogers RO4003
    • Polyimide
    • Teflon
    • Black FR4
    • Getek copper
    • Clad thermal substrates
    • Hybrid (Rogers and FR4)
    • BT Epoxy
    • Nelco 4013
    • If you don’t see the material above, please contact us because we most likely have it in stock or can special order it for you
  • Finishes we are able to provide our customers:
    • HASL–leaded solder tin/nickel
    • HASL–lead free solder
    • Electroless soft gold
    • Wire bondable soft gold
    • Nickel flash gold
    • Electroless nickel
    • Immersion gold OSP
    • Electrolytic nickel/hard gold and selective gold
    • Immersion silver
    • Immersion tin
    • Carbon ink
    • ENIG
    • Please contact us if you need a finish that is not listed here
  • Layers: 4 
  • Material: FR4
  • Thickness: 1.0mm
  • Cu thickness: 35/35um
  • Surface finishing: BGA
  • Solder mask: green
  • Silkscreen: white 
  • Outline: routing
  • Testing: flying Probe or test fixture
  • FR4 (Tg – 135C, 145C, 170C)
  • Rogers ultralam 2000
  • Rogers RO4350
  • Rogers RO4003
  • Polyimide
  • Teflon
  • Black FR4
  • Getek copper
  • Clad thermal substrates
  • Hybrid (Rogers and FR4)
  • BT Epoxy
  • Nelco 4013
  • If you don’t see the material above, please contact us because we most likely have it in stock or can special order it for you
  • HASL–leaded solder tin/nickel
  • HASL–lead free solder
  • Electroless soft gold
  • Wire bondable soft gold
  • Nickel flash gold
  • Electroless nickel
  • Immersion gold OSP
  • Electrolytic nickel/hard gold and selective gold
  • Immersion silver
  • Immersion tin
  • Carbon ink
  • ENIG
  • Please contact us if you need a finish that is not listed here

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    • Ms.  Cheng

    • Enter between 20 to 4,000 characters.

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