Shenzhen Keyou Circuit Technology Co. Ltd
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Shenzhen Keyou Circuit Technology Co. Ltd
Pocket Sports GPS and Vehicle Tracker PCB, 1.6mm Board Thickness, 1oz Copper Thickness
  • Pocket Sports GPS and Vehicle Tracker PCB, 1.6mm Board Thickness, 1oz Copper Thickness
Pocket Sports GPS and Vehicle Tracker PCB, 1.6mm Board Thickness, 1oz Copper Thickness

Pocket Sports GPS and Vehicle Tracker PCB, 1.6mm Board Thickness, 1oz Copper Thickness

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Basic Info
Basic Info
Payment Type: TT,LC,PAYPAL
Product Description
Product Description
  • Features::
    • Layer count: 6 layers
    • Major material: FR4
    • Board thickness: 1.6mm
    • Surface finishing: immersion gold
    • Solder mask: blue
    • Copper thickness: 1oz
    • Minimum hole size: 0.3mm
    • Minimum line width and spacing: 4-mil
    • The following is the whole manufacturer capacibility:
  • Specifications:
    • Item:
      • Material: FR-4/Hi Tg FR-4/lead-free
      • Materials (RoHS Directive-compliant)/CEM-3, aluminum, metal based
      • Layer: 1-16
      • Finished board thickness: 0.2-3.5mm (8-138-mil)
      • Board thickness tolerance: ±10%
      • Cooper thickness: 0.5-4oz (18-144um)
      • Copper plating hole: 18-40um
      • Impedance control: ±10%
      • Warp and twist: 0.70% 
    • Image:
      • Minimum trace width (a): 0.075mm (3-mil)
      • Minimum space width (b): 0.075mm (3-mil)     
      • SMD pitch: 0.2mm (8-mil)
      • BGA pitch: 0.2mm (8-mil)
    • Solder mask:
      • Minimum solder mask (D): 0.0635mm (2.5-mil)
      • Solder mask clearance: 0.075mm (3-mil)
      • Minimum SMT pad spacing: 0.075mm (3-mil)
      • Solder mask thickness: 0.00070-inch (0.018mm)
    • Holes:
      • Minimum hole size (CNC): 0.2mm (8-mil)
      • Minimum punch hole size: 0.9mm (35-mil)
      • Hole size tolerance:
        • PTH: ±0.075mm
        • NPTH: ±0.05mm
      • Hole position tolerance: ±0.075mm
    • Plating:
      • HASL/lead-free HASL: 2.5um
      • Immersion gold nickel: 3-7um
      • Au: 1-5u-inch
      • OSP: 0.2-0.5um
    • Certificates: RoHS, SGS, UL
  • Layer count: 6 layers
  • Major material: FR4
  • Board thickness: 1.6mm
  • Surface finishing: immersion gold
  • Solder mask: blue
  • Copper thickness: 1oz
  • Minimum hole size: 0.3mm
  • Minimum line width and spacing: 4-mil
  • The following is the whole manufacturer capacibility:
  • Item:
    • Material: FR-4/Hi Tg FR-4/lead-free
    • Materials (RoHS Directive-compliant)/CEM-3, aluminum, metal based
    • Layer: 1-16
    • Finished board thickness: 0.2-3.5mm (8-138-mil)
    • Board thickness tolerance: ±10%
    • Cooper thickness: 0.5-4oz (18-144um)
    • Copper plating hole: 18-40um
    • Impedance control: ±10%
    • Warp and twist: 0.70% 
  • Image:
    • Minimum trace width (a): 0.075mm (3-mil)
    • Minimum space width (b): 0.075mm (3-mil)     
    • SMD pitch: 0.2mm (8-mil)
    • BGA pitch: 0.2mm (8-mil)
  • Solder mask:
    • Minimum solder mask (D): 0.0635mm (2.5-mil)
    • Solder mask clearance: 0.075mm (3-mil)
    • Minimum SMT pad spacing: 0.075mm (3-mil)
    • Solder mask thickness: 0.00070-inch (0.018mm)
  • Holes:
    • Minimum hole size (CNC): 0.2mm (8-mil)
    • Minimum punch hole size: 0.9mm (35-mil)
    • Hole size tolerance:
      • PTH: ±0.075mm
      • NPTH: ±0.05mm
    • Hole position tolerance: ±0.075mm
  • Plating:
    • HASL/lead-free HASL: 2.5um
    • Immersion gold nickel: 3-7um
    • Au: 1-5u-inch
    • OSP: 0.2-0.5um
  • Certificates: RoHS, SGS, UL
  • Material: FR-4/Hi Tg FR-4/lead-free
  • Materials (RoHS Directive-compliant)/CEM-3, aluminum, metal based
  • Layer: 1-16
  • Finished board thickness: 0.2-3.5mm (8-138-mil)
  • Board thickness tolerance: ±10%
  • Cooper thickness: 0.5-4oz (18-144um)
  • Copper plating hole: 18-40um
  • Impedance control: ±10%
  • Warp and twist: 0.70% 
  • Minimum trace width (a): 0.075mm (3-mil)
  • Minimum space width (b): 0.075mm (3-mil)     
  • SMD pitch: 0.2mm (8-mil)
  • BGA pitch: 0.2mm (8-mil)
  • Minimum solder mask (D): 0.0635mm (2.5-mil)
  • Solder mask clearance: 0.075mm (3-mil)
  • Minimum SMT pad spacing: 0.075mm (3-mil)
  • Solder mask thickness: 0.00070-inch (0.018mm)
  • Minimum hole size (CNC): 0.2mm (8-mil)
  • Minimum punch hole size: 0.9mm (35-mil)
  • Hole size tolerance:
    • PTH: ±0.075mm
    • NPTH: ±0.05mm
  • Hole position tolerance: ±0.075mm
  • PTH: ±0.075mm
  • NPTH: ±0.05mm
  • HASL/lead-free HASL: 2.5um
  • Immersion gold nickel: 3-7um
  • Au: 1-5u-inch
  • OSP: 0.2-0.5um

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