Multi-layered PCB with FR4 Material

Get Latest Price

Quantity:

Your message must be between 20 to 2000 characters

Contact Now

Basic Info

Payment Type:	T/T, L/C, PayPal

Product Description

Layer count: double layers

Major material: FR4

Board thickness: 1.6mm

Surface finishing: lead-free

Solder mask: green

Copper thickness: 1oz

Min hole size: 0.3mm

Min line width and spacing: 4mil

Whole manufacturer capability:

Item:
- Material: FR-4/Hi Tg FR-4/lead-free materials (RoHS compliant)/CEM-3, aluminium, metal-based
- Layer number: 1-16
- Finished board thickness: 0.2mm-3.5mm (8mil-138mil)
- Board thickness tolerance: ±10%
- Copper thickness: 0.5-4oz (18um-144um)
- Copper plating hole: 18-40um
- Impedance control: ±10%
- Warp and twist: 0.70%
Image:
- Min trace width (a): 0.075mm (3 mil)
- Min space width (b): 0.075mm (3 mil)
- SMD pitch (a): 0.2mm(8 mil)
- BGA pitch (b): 0.2mm (8 mil)
Solder mask:
- Min solder mask dam (a): 0.0635mm (2.5mil)
- Soldermask clearance (b): 0.075mm (3 mil)
- Min SMT pad spacing (c): 0.075mm (3 mil)
- Solder mask thickness: 0.0007" (0.018mm)
Holes:
- Min hole size (CNC): 0.2mm (8 mil)
- Min punch hole size: 0.9mm (35 mil)
- Hole size Tol(+/-): PTH ±0.075mm, NPTH ±0.05mm
- Hole position Tol: ±0.075mm
Plating:
- HASL/lead-free HASL: 2.5um
- Immersion gold nickel: 3-7um, Au 1-5u"
- OSP: 0.2-0.5um
Certificate: RoHS, ISO 9001:2008, SGS, UL

Item:

Material: FR-4/Hi Tg FR-4/lead-free materials (RoHS compliant)/CEM-3, aluminium, metal-based
Layer number: 1-16
Finished board thickness: 0.2mm-3.5mm (8mil-138mil)
Board thickness tolerance: ±10%
Copper thickness: 0.5-4oz (18um-144um)
Copper plating hole: 18-40um
Impedance control: ±10%
Warp and twist: 0.70%

Image: