Green Solder Mask Single-sided FR4 PCB with 1.6mm Board Thickness

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Basic Info

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Product Description

Specifications:

Layer count: one
Major material: FR4
Board thickness: 1.6mm
Surface finishing: immersion gold
Solder mask: green
Copper thickness: 1oz
Minimum hole size: 0.3mm
Minimum line width and spacing: 4-mil
Manufacturer capability:
- Material: FR-4/Hi Tg FR-4/lead free, (RoHS Directive-compliant)/CEM-3, aluminum, metal based
- Layer numbers: 1-16
- Finished board thickness: 0.2-3.5mm, (8-138 mils)
- Board thickness tolerance: ±10%
- Cooper thicknesses: 0.5-4oz (18-144um)
- Copper plating hole: 18-40um
- Impedance control: ±10%
- Warp and twist: 0.70%
Image:
- Min trace width (a): 0.075mm (3-mil)
- Min space width (b): 0.075mm (3-mil)
- SMD pitch (a): 0.2mm (8-mil)
- BGA pitch (b): 0.2mm (8-mil)
Solder mask:
- Min solder mask dam (a): 0.0635mm (2.5-mil)
- Solder mask clearance (b): 0.075mm (3-mil)
- Min SMT pad spacing (c): 0.075mm (3-mil)
- Solder mask thickness: 0.0007-inch (0.018mm)
Holes:
- Min hole size (CNC): 0.2mm (8-mil)
- Min punch hole size: 0.9mm (35-mil)
- Hole size: PTH: ±0.075mm, NPTH: ±0.05mm
- Hole position: ±0.075mm
Plating:
- HASL/lead free HASL: 2.5um
- Immersion gold nickel: 3-7um Au: 1-5u
- OSP: 0.2-0.5um
Certificates: RoHS, SGS and UL

Layer count: one

Major material: FR4

Board thickness: 1.6mm

Surface finishing: immersion gold

Solder mask: green

Copper thickness: 1oz

Minimum hole size: 0.3mm

Minimum line width and spacing: 4-mil

Manufacturer capability:

Material: FR-4/Hi Tg FR-4/lead free, (RoHS Directive-compliant)/CEM-3, aluminum, metal based
Layer numbers: 1-16
Finished board thickness: 0.2-3.5mm, (8-138 mils)
Board thickness tolerance: ±10%
Cooper thicknesses: 0.5-4oz (18-144um)
Copper plating hole: 18-40um
Impedance control: ±10%
Warp and twist: 0.70%

Image: