Immersion Tin FR4 Multilayer PCB with 1.6mm Board Thickness, Immersion Tin Surface Finish

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Basic Info

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Product Description

Layers: 6

Major material: FR4

Board thickness: 1.6mm

Surface finishing: immersion tin

Solder mask: green

Copper thickness: 1oz

Minimum hole size: 0.3mm

Minimum line width and spacing: 4-mil

Image:

Solder mask:

Holes:

Plating:

Certificates: RoHS, SGS, UL

Minimum trace width: 0.075mm (3-mil)

Minimum space width: 0.075mm (3-mil)

SMD pitch: 0.2mm (8-mil)

BGA pitch: 0.2mm (8-mil)

Minimum solder mask dam: 0.0635mm (2.5-mil)

Solder mask clearance: 0.075mm (3-mil)

Minimum SMT pad spacing: 0.075mm (3-mil)

Solder mask thickness: 0.0007-inch (0.018mm)

Minimum size (CNC): 0.2mm (8-mil)

Minimum punch size: 0.9mm (35-mil)

Sizes:

Position tolerance: ±0.075mm

PTH: ±0.075mm

NPTH: ±0.05mm

Lead-free HASL: 2.5um

Immersion gold nickel: 3-7um Au 1-5u''

OSP: 0.2-0.5um

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