High Precision FR4 Multilayer PCB

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Basic Info

Payment Type:	TT,LC,PAYPAL

Product Description

Layer counts: 6

Major material: FR4

Board thickness: 1.6mm

Surface finishing: lead free

Solder mask: Green

Copper thickness: 1oz

Min hole size: 0.3mm

Min line width and spacing: 4mil

Image:

Solder mask:

Holes:

Plating:

Certificates: RoHS, ISO9001:2008, SGS, UL

Min trace width: 0.075mm (3 mil)

Min space Width: 0.075mm (3 mil)

SMD pitch: 0.2 mm(8 mil)

BGA pitch: 0.2 mm (8 mil)

Min solder mask dam: 0.0635 mm (2.5mil)

Soldermask clearance: 0.075mm (3 mil)

Min SMT pad spacing: 0.075mm (3 mil)

Solder mask thickness: 0.0007" (0.018mm)

Min size (CNC): 0.2 mm (8 mil)

Min punch size: 0.9 mm (35 mil)

Size tol(+/-): PTH ±0.075mm, NPTH ±0.05mm

Position tol: ±0.075mm

Lead free HASL: 2.5um

Immersion gold nickel: 3-7um Au 1-5u''

OSP: 0.2-0.5um

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