Shenzhen Keyou Circuit Technology Co. Ltd
Shenzhen Keyou Circuit Technology Co. Ltd
FR4 two layered BGA PCBs assembly with 1.6mm thickness, low volume
  • FR4 two layered BGA PCBs assembly with 1.6mm thickness, low volume
FR4 two layered BGA PCBs assembly with 1.6mm thickness, low volume

FR4 two layered BGA PCBs assembly with 1.6mm thickness, low volume

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Basic Info
Basic Info
Payment Type: Telegraphic Transfer (TT,T/T)
Product Description
Product Description
  • Layer count: 2 layers
  • Major material: FR4
  • Board thickness: 1.6mm
  • Surface finishing: BGA
  • Soldermask: Green
  • Copper thickness: 1oz
  • Minimum hole size: 0.3mm
  • Minimum line width and spacing: 4mil
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