Shenzhen Keyou Circuit Technology Co. Ltd
Products
Products
Shenzhen Keyou Circuit Technology Co. Ltd
FR4 94V0 PCB and PCBA with 1.6mm Board Thickness
  • FR4 94V0 PCB and PCBA with 1.6mm Board Thickness
FR4 94V0 PCB and PCBA with 1.6mm Board Thickness

FR4 94V0 PCB and PCBA with 1.6mm Board Thickness

Get Latest Price
Payment Type:
T/T, PayPal
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Payment Type: T/T, PayPal
Product Description
Product Description
  • Specifications:
    • Layer count: 4 layers
    • Major material: FR4
    • Board thickness: 1.6mm
    • Surface finishing: lead-free, HASL, flash gold  
    • Solder mask: green, yellow, blue, red 
    • Copper thickness: 1oz
    • Minimum hole size: 0.3mm
    • Minimum line width and spacing: 4-mil
    • Whole manufacturer capability:
  • Item:
    • Material: FR-4/Hi Tg FR-4/lead-free materials (RoHS compliant)/CEM-3, aluminum, metal-based
    • Layer number: 1-16
    • Finished board thickness: 0.2mm-3.5mm (8mil-138mil)
    • Board thickness tolerance: ±10%
    • Copper thickness: 0.5-4oz (18um-144um)
    • Copper plating hole: 18-40um
    • Impedance control: ±10%
    • Warp and twist: 0.70%
  • Image:
    • Minimum trace width (a): 0.075mm (3-mil)
    • Minimum space width (b): 0.075mm (3-mil)     
    • SMD pitch (a): 0.2mm (8-mil)
    • BGA pitch (b): 0.2mm (8-mil)
  • Solder mask:
    • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
    • Solder mask clearance (b): 0.075mm (3-mil)
    • Minimum SMT pad spacing (c): 0.075mm (3-mil)
    • Solder mask thickness: 0.0007" (0.018mm)
  • Holes:
    • Min hole size (CNC): 0.2mm (8-mil)
    • Min punch hole size: 0.9mm (35-mil)
    • Hole size tol (+/-): PTH ±0.075mm, NPTH ±0.05mm
    • Hole position tol: ±0.075mm
  • Plating:
    • HASL/lead-free HASL: 2.5um
    • Immersion gold nickel: 3-7um, Au 1-5u-inch
    • OSP: 0.2-0.5um
  • Certificates: RoHS, SGS, UL
  • Layer count: 4 layers
  • Major material: FR4
  • Board thickness: 1.6mm
  • Surface finishing: lead-free, HASL, flash gold  
  • Solder mask: green, yellow, blue, red 
  • Copper thickness: 1oz
  • Minimum hole size: 0.3mm
  • Minimum line width and spacing: 4-mil
  • Whole manufacturer capability:
  • Material: FR-4/Hi Tg FR-4/lead-free materials (RoHS compliant)/CEM-3, aluminum, metal-based
  • Layer number: 1-16
  • Finished board thickness: 0.2mm-3.5mm (8mil-138mil)
  • Board thickness tolerance: ±10%
  • Copper thickness: 0.5-4oz (18um-144um)
  • Copper plating hole: 18-40um
  • Impedance control: ±10%
  • Warp and twist: 0.70%
  • Minimum trace width (a): 0.075mm (3-mil)
  • Minimum space width (b): 0.075mm (3-mil)     
  • SMD pitch (a): 0.2mm (8-mil)
  • BGA pitch (b): 0.2mm (8-mil)
  • Minimum solder mask dam (a): 0.0635mm (2.5-mil)
  • Solder mask clearance (b): 0.075mm (3-mil)
  • Minimum SMT pad spacing (c): 0.075mm (3-mil)
  • Solder mask thickness: 0.0007" (0.018mm)
  • Min hole size (CNC): 0.2mm (8-mil)
  • Min punch hole size: 0.9mm (35-mil)
  • Hole size tol (+/-): PTH ±0.075mm, NPTH ±0.05mm
  • Hole position tol: ±0.075mm
  • HASL/lead-free HASL: 2.5um
  • Immersion gold nickel: 3-7um, Au 1-5u-inch
  • OSP: 0.2-0.5um

    • Send your message to this supplier

    • Ms.  Cheng

    • Enter between 20 to 4,000 characters.

    Related Products

    Related Keywords

    Related Keywords
    Related Products
    Product Categories