Multilayer PCB with LF HASL Surface Finishing, 1.6mm Board Thickness

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Basic Info

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Product Description

Layer count: double layers

Major material: FR4

Board thickness: 1.6mm

Surface finishing: lead-free

Solder mask: green

Copper thickness: 1oz

Minimum hole size: 0.3mm

Minimum line width and spacing: 4mil

The following is the whole manufacturer capability:

Item:
- Material: FR-4/Hi Tg FR-4/lead-free materials (RoHS Directive-compliant)/CEM-3, aluminum, metal based
- Layer number: 1-16
- Finished board thickness: 0.2-3.5mm’ (8-138mil)
- Board thickness tolerance: ±10%
- Cooper thickness: 0.5-4oz (18-144um)
- Copper plating hole: 18-40um
- Impedance control: ±10%
- Warp and twist: 0.70%
Image:
- Minimum trace width (a): 0.075mm (3mil)
- Minimum space width (b): 0.075mm (3mil)
- SMD pitch (a): 0.2 mm (8mil)
- BGA pitch (b): 0.2 mm (8mil)
Solder mask:
- Minimum solder mask dam (a): 0.0635mm (2.5mil)
- Solder mask clearance (b): 0.075mm (3mil)
- Minimum SMT pad spacing (c): 0.075mm (3mil)
- Solder mask thickness: 0.0007" (0.018mm)
Holes:
- Minimum hole size (CNC): 0.2mm (8mil)
- Minimum punch hole size: 0.9mm (35mil)
- Hole size tolerance (+/-):
  - PTH: ±0.075mm
  - NPTH: ±0.05mm
- Hole position tolerance: ±0.075mm
Plating:
- HASL/lead-free HASL: 2.5um
- Immersion gold nickel: 3-7um, Au: 1-5u''
- OSP: 0.2-0.5um
Certificates:
- RoHS, ISO9001:2008, SGS, UL certificates

Item:

Material: FR-4/Hi Tg FR-4/lead-free materials (RoHS Directive-compliant)/CEM-3, aluminum, metal based
Layer number: 1-16
Finished board thickness: 0.2-3.5mm’ (8-138mil)
Board thickness tolerance: ±10%
Cooper thickness: 0.5-4oz (18-144um)
Copper plating hole: 18-40um
Impedance control: ±10%
Warp and twist: 0.70%

Image: