Immersed-gold PCB Board for Electronics, 1.6mm Board Thickness

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Basic Info

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Product Description

Layer counts: 4

Major material: FR4

Board thickness: 1.6mm

Surface finishing: immersion gold

Soldermask: green

Copper thickness: 1oz

Min hole size: 0.3mm

Min line width and spacing: 4mil

Image:

Soldermask:

Holes:

Plating:

Certificates: RoHS, ISO 9001:2008, SGS, UL

Min trace width: 0.075mm (3 mils)

Min space width: 0.075mm (3 mils)

SMD pitch: 0.2mm (8 mils)

BGA pitch: 0.2mm (8 mils)

Min soldermask dam: 0.0635mm (2.5mil)

Soldermask clearance: 0.075mm (3mil)

Min SMT pad spacing: 0.075mm (3mil)

Solder mask thickness: 0.0007" (0.018mm)

Min size (CNC): 0.2mm (8mil)

Min punch size: 0.9mm (35mil)

Size tolerance (+/-):

Position tolerance: ±0.075mm

PTH: ±0.075mm

NPTH: ±0.05mm

Lead free HASL: 2.5um

Immersion gold nickel: 3-7um Au 1-5u''

OSP: 0.2-0.5um

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