Shenzhen Keyou Circuit Technology Co. Ltd
Products
Products
Shenzhen Keyou Circuit Technology Co. Ltd
High Frequency Double-sided PCB with Minimum Diameter of 0.3mm
  • High Frequency Double-sided PCB with Minimum Diameter of 0.3mm
High Frequency Double-sided PCB with Minimum Diameter of 0.3mm

High Frequency Double-sided PCB with Minimum Diameter of 0.3mm

Get Latest Price
Payment Type:
TT, LC, PayPal
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Payment Type: TT, LC, PayPal
Product Description
Product Description
  • Layer count: double layers
  • Major material: FR4
  • Board thickness: 1.6mm
  • Surface finishing: lead-free
  • Solder mask: green
  • Copper thickness: 1oz
  • Min hole size: 0.3mm
  • Min line width and spacing: 4mil
  • The following is the whole manufacturer capability:
    • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHS-compliant)/CEM-3, aluminum, metal-based
    • Layer no.: 1-16
    • Finished board thickness: 0.2 mm-3.5mm’(8 mil-138 mil)
    • Board thickness tolerance: ±10%
    • Cooper thickness: 0.5-4oz (18um-144um)
    • Copper plating hole: 18-40 um
    • Impedance control: ±10%
    • Warp and twist: 0.70%             
  • Image:
    • Min trace width: 0.075mm (3mil)
    • Min space width: 0.075mm (3 mil)     
    • SMD pitch: 0.2mm (8mil)
    • BGA pitch: 0.2mm (8mil)
  • Solder mask:
    • Min solder mask dam: 0.0635mm (2.5mil)
    • Soldermask clearance: 0.075mm (3mil)
    • Min SMT pad spacing: 0.075mm (3mil)
    • Solder mask thickness: 0.0007" (0.018mm)
  • Holes:
    • Min hole size (CNC): 0.2mm (8mil)
    • Min punch hole size: 0.9mm (35mil)
    • Hole size tolerance (+/-):
      • PTH: ±0.075mm
      • NPTH: ±0.05mm
    • Hole position tolerance: ±0.075mm
  • Plating:
    • HASL/lead-free HASL: 2.5um
    • Immersion gold nickel: 3-7um, Au:1-5u"
    • OSP: 0.2-0.5um
  • Certificates:
    • RoHS,  ISO 9001:2008, SGS, UL
  • Materials: FR-4/Hi Tg FR-4/lead-free materials (RoHS-compliant)/CEM-3, aluminum, metal-based
  • Layer no.: 1-16
  • Finished board thickness: 0.2 mm-3.5mm’(8 mil-138 mil)
  • Board thickness tolerance: ±10%
  • Cooper thickness: 0.5-4oz (18um-144um)
  • Copper plating hole: 18-40 um
  • Impedance control: ±10%
  • Warp and twist: 0.70%             
  • Min trace width: 0.075mm (3mil)
  • Min space width: 0.075mm (3 mil)     
  • SMD pitch: 0.2mm (8mil)
  • BGA pitch: 0.2mm (8mil)
  • Min solder mask dam: 0.0635mm (2.5mil)
  • Soldermask clearance: 0.075mm (3mil)
  • Min SMT pad spacing: 0.075mm (3mil)
  • Solder mask thickness: 0.0007" (0.018mm)
  • Min hole size (CNC): 0.2mm (8mil)
  • Min punch hole size: 0.9mm (35mil)
  • Hole size tolerance (+/-):
    • PTH: ±0.075mm
    • NPTH: ±0.05mm
  • Hole position tolerance: ±0.075mm
  • PTH: ±0.075mm
  • NPTH: ±0.05mm
  • HASL/lead-free HASL: 2.5um
  • Immersion gold nickel: 3-7um, Au:1-5u"
  • OSP: 0.2-0.5um
  • RoHS,  ISO 9001:2008, SGS, UL

    • Send your message to this supplier

    • Ms.  Cheng

    • Enter between 20 to 4,000 characters.

    Related Products

    Related Keywords

    Related Keywords
    Related Products
    Product Categories