Rapid SMT PCB Assembly, Prototyping, Fast Delivery

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Basic Info

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Product Description

Material: FR4

Layer: 2L

PCB thickness: 1.6mm+/-10%

Copper thickness: 1/1/1/1oz

Surface treatment: HASL

Solder resist: red

Silkscreen: white

E-Tests

Craft ability table:

Whole manufacturer capability:

Item:
- Materials: FR-4/high Tg FR-4/lead-free materials (RoHS-compliant)/CEM-3, aluminum, metal based
- Layer number: 1-16
- Finished board thickness: 0.2mm-3.5mm (8mil-138 mil)
- Board thickness tolerance: ±10%
- Cooper thickness: 0.5-4oz (18um-144um)
- Copper plating hole: 18-40um
- Impedance control: ±10%
- Warp and twist: 0.70%
Image:
- Min trace width (a): 0.075mm (3 mil)
- Min space width (b): 0.075mm (3 mil)
- SMD pitch (a): 0.2mm (8 mil)
- BGA pitch (b): 0.2mm (8 mil)
Solder mask:
- Min solder mask dam: (a) 0.0635mm (2.5mil)
- Solder mask clearance: (b) 0.075mm (3 mil)
- Min SMT pad spacing: (c) 0.075mm (3 mil)
- Solder mask thickness: 0.0007" (0.018mm)
Holes:
- Min hole size (CNC): 0.2mm (8 mil)
- Min punch hole size: 0.9 mm (35 mil)
- Hole size tolerance (+/-):
  - PTH: ±0.075mm
  - NPTH: ±0.05mm
- Hole position tolerance: ±0.075mm
Plating:
- HASL/lead-free HASL: 2.5um
- Immersion gold nickel: 3-7um
- Au: 1-5um

Minimum line width/spacing: 0.075/0.075mm

Minimum solder mask dam: 0.075mm

Minimum and maximum board thickness: 0.2 mm-3.5mm

Maximum finish copper thickness: 0.5-4oz

Maximum layer count: 8

Impedance control: ±8%

Item:

Materials: FR-4/high Tg FR-4/lead-free materials (RoHS-compliant)/CEM-3, aluminum, metal based
Layer number: 1-16
Finished board thickness: 0.2mm-3.5mm (8mil-138 mil)
Board thickness tolerance: ±10%
Cooper thickness: 0.5-4oz (18um-144um)
Copper plating hole: 18-40um
Impedance control: ±10%
Warp and twist: 0.70%

Image: