Double-sided FR4 LED PCB with 0.22mm Board ThicknessNew

Double-sided FR4 LED PCB with 0.22mm Board ThicknessNew

Get Latest Price

Payment Type:: TT, LC, PAYPAL

Quantity:

Your message must be between 20 to 2000 characters

Contact Now

Basic Info

Payment Type:	TT,LC,PAYPAL

Product Description

Specifications:

Layer count: Double layers
Major material: FR4
Board thickness: 0.22mm
Surface finishing: Immersion gold
Solder mask: White
Copper thickness: 1oz
Min hole size: 0.3mm
Min line width and spacing: 4mil

The following is the whole manufacturer capacibility:

Material: FR-4/Hi Tg FR-4/Lead free
Materials (RoHS Compliant) /CEM-3, aluminium, metal based
Layer No: 1~16
Finished board thickness range: 0.2mm-3.5mm (8mil-138mil)
Board thickness tolerance: ±10%
Cooper thickness range: 0.5oz-4oz (18 um-144um)
Copper plating hole: 18-40um
Impedance control: ±10%
Warp & twist: 0.70%

Image:

Min trace width: 0.075mm (3 mil)
Min space width: 0.075mm (3 mil)
SMD pitch: 0.2mm (8 mil)
BGA pitch: 0.2mm (8 mil)

Solder Mask

Min solder mask dam: 0.0635 mm (2.5mil)
Soldermask clearance: 0.075mm (3 mil)
Min SMT pad spacing: 0.075mm (3 mil)
Solder mask thickness: 0.0007" (0.018mm)

Holes:

Min hole size (CNC): 0.2mm (8 mil)
Min punch hole size: 0.9 mm (35 mil)
Hole size tol (+/-):
- PTH: ±0.075mm
- NPTH:±0.05mm
Hole position tol: ±0.075mm

Plating

HASL/lead free HASL: 2.5um
Immersion gold nickel: 3-7um Au: 1-5u''
OSP: 0.2-0.5um

RoHS, ISO9001:2008, SGS, UL certificate

Layer count: Double layers

Major material: FR4

Board thickness: 0.22mm

Surface finishing: Immersion gold

Solder mask: White

Copper thickness: 1oz

Min hole size: 0.3mm

Min line width and spacing: 4mil

Material: FR-4/Hi Tg FR-4/Lead free

Materials (RoHS Compliant) /CEM-3, aluminium, metal based

Layer No: 1~16

Finished board thickness range: 0.2mm-3.5mm (8mil-138mil)

Board thickness tolerance: ±10%

Cooper thickness range: 0.5oz-4oz (18 um-144um)

Copper plating hole: 18-40um

Impedance control: ±10%

Warp & twist: 0.70%

Min trace width: 0.075mm (3 mil)

Min space width: 0.075mm (3 mil)

SMD pitch: 0.2mm (8 mil)

BGA pitch: 0.2mm (8 mil)

Min solder mask dam: 0.0635 mm (2.5mil)

Soldermask clearance: 0.075mm (3 mil)

Min SMT pad spacing: 0.075mm (3 mil)

Solder mask thickness: 0.0007" (0.018mm)

Min hole size (CNC): 0.2mm (8 mil)

Min punch hole size: 0.9 mm (35 mil)

Hole size tol (+/-):

PTH: ±0.075mm
NPTH:±0.05mm

Hole position tol: ±0.075mm

PTH: ±0.075mm

NPTH:±0.05mm

HASL/lead free HASL: 2.5um

Immersion gold nickel: 3-7um Au: 1-5u''

OSP: 0.2-0.5um

Send your message to this supplier

* From:
* To:

Ms. Cheng
* Messages:

Enter between 20 to 4,000 characters.

Related Keywords