Tested PCBs for LED Use

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Basic Info

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Product Description

Board thickness: 1.6mm

Layers: single side

Minimum line width/spacing: 4Mil

Minimum hole diameter: 0.3mm

Finish copper thickness: 1oz

Surface finish: Lead-free

Soldermask: white

The following is the whole manufacturer capability:

Material: FR-4/Hi Tg FR-4/Lead-free materials (RoHS-compliant) /CEM-3, aluminum, metal base
Layer number: 1-16
Finished board thicknesses: 0.2-3.5mm (8-138mil)
Board thickness tolerance: ±10%
Copper thickness: 0.5-4oz (18-144um)
Copper plating hole: 18-40um
Impedance control: ±10%
Warp and twist: 0.70%
Minimum trace width: 0.075mm (3 mil)
Minimum space width: 0.075mm (3 mil)
SMD pitch: 0.2mm (8mil)
BGA pitch: 0.2mm (8mil)
Minimum soldermask dam: 0.0635mm (2.5mil)
Soldermask clearance: 0.075mm (3 mil)
Minimum SMT pad spacing: 0.075mm (3 mil)
Soldermask thickness: 0.0007" (0.018mm)
Minimum hole size (CNC): 0.2mm (8 mil)
Board thickness: 1.6mm
Layers: 2
Minimum line width/spacing: 4mil
Minimum hole diameter: 0.3mm
Finish copper thickness: 1oz
Surface finish: Lead-free HAL
Soldermask: white
Minimum punch hole size: 0.9mm (35 mil)
Hole size tolerance (+/-): PTH: ±0.075mm; NPTH: ±0.05mm
Hole position tolerance: ±0.075mm
HASL/Lead-free HASL: 2.5um
Immersion gold nickel: 3-7um Au:1-5u"
OSP: 0.2-0.5um
Certification: RoHS, ISO 9001:2008, SGS-, UL