8 Layer Gold Finger and BGA PCB with Impedance Control (0-K-8L-1)
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| Place of Origin: | Shenzhen, China |
|---|---|
| Payment Type: | T/T |
Product Description
Product Description
8 Layer Gold Finger and BGA PCB with Impedance Control
Layer: 8
Material: FR4 Laminate, RoHS compliance
PCB Thickness: 1.6mm+/-10%
Final Copper: 1oz
Min Hole: 0.25mm
Min line Width/Space: 6/5mil
Soldermask: Green
Legend: White
Surface: Immersion Gold + Gold Finger
Impedance Control: Yes
Outline: Rout and Score
E-Test: 100%
Outgoing Reports: Final Inspection, E-Test, Solderability Test, Microsection and so on.
Inspection Standard: IPC-A-600H/IPC-6012B, Class 2/3
Certificates: UL, SGS, RoHS, ISO9001: 2008, ISO14001: 2004, ISO TS16949: 2009
Layer: 8
Material: FR4 Laminate, RoHS compliance
PCB Thickness: 1.6mm+/-10%
Final Copper: 1oz
Min Hole: 0.25mm
Min line Width/Space: 6/5mil
Soldermask: Green
Legend: White
Surface: Immersion Gold + Gold Finger
Impedance Control: Yes
Outline: Rout and Score
E-Test: 100%
Outgoing Reports: Final Inspection, E-Test, Solderability Test, Microsection and so on.
Inspection Standard: IPC-A-600H/IPC-6012B, Class 2/3
Certificates: UL, SGS, RoHS, ISO9001: 2008, ISO14001: 2004, ISO TS16949: 2009
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