Shenzhen X-Mulong Circuit Co., Ltd.
Shenzhen X-Mulong Circuit Co., Ltd.
6 Layer PCB, Multilayer PCB, Blind/Buried Vias, Impedance Control
  • 6 Layer PCB, Multilayer PCB, Blind/Buried Vias, Impedance Control
6 Layer PCB, Multilayer PCB, Blind/Buried Vias, Impedance Control

6 Layer PCB, Multilayer PCB, Blind/Buried Vias, Impedance Control

Payment Type:
L/C, T/T, Western Union, Paypal
Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Place of Origin: China
Payment Type: L/C, T/T, Western Union, Paypal
Product Description
Product Description
6 Layer PCB, Multilayer PCB, Blind/Buried Vias, impedance control
Layer: 6-layer
Material: FR4 tg135+/-5
Board thickness: 1.6mm +/-10%
Final copper: 1~1oz
Min. Hole size: 0.25mm, Blind/buried hole: L1~L2, L5~L6
Min. Trace width: 4 mil
Min. Trace space: 4 mil
Surface finish: Immersion Gold
Profile: Routing
E-test: 100% Fixture
Quality report: Solderability test, E-test report, Final inspection
RoHS compliant, Lead free, ISO 9001, UL94V-0, IPC CLASS 2

Send your message to this supplier

  • Mr. Kenny Chan

  • Enter between 20 to 4,000 characters.

Related Keywords

Related Keywords