4L Smart Phone Board OSP+Enig Finishing UL Approved Phone PCB

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Basic Info

Place of Origin:	Shenzhen, China
Payment Type:	L/C, T/T, Paypal, Western Union

Product Description

  Model No.:                       KG-M4-013
Number of Layers:        4L smart phone board
Base-Material:               FR4
Thickness:                       0.7 mm+/-0.05mm
Final-Cu:                          H/Hoz
Impedance:                    No
Blind and buried via:    No
Min. Drill hole:               0.2mm
Min. Line space:            0.1mm
Min. Line width:            0.1mm
Mech. Treatment:         Routing
Surface Treatment:      OSP+ENIG
  Solder-Mask:                 Green
  Legend-Print:                White
100% E-Test:                 Yes

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