Impedance BGA Multi Layer 6 L 0.1mm Fine Line OSP Fr4 UL ISO Circuit Board (KG-M6-013)

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Basic Info

Place of Origin:	Shenzhen, China
Payment Type:	L/C, T/T, Western Union, Paypal

Product Description

  Model No.:                       KG-M6-013
Number of Layers:        6L
Base-Material:               FR4
Thickness:                       1.6 mm+/-10%
Final-Cu:                          35/35um
Impedance:                    Yes
Blind and buried via:    No
Min. Drill hole:               0.2mm
Min. Line space:            0.1mm
Min. Line width:            0.1mm
Mech. Treatment:         Routing
Surface Treatment:      OSP
  Solder-Mask:                 Green
  Legend-Print:                White
100% E-Test:                 Yes

Impedance BGA Multi Layer 6 L 0.1mm Fine Line OSP Fr4 UL ISO Circuit Board (KG-M6-013)

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