Semiconductor Metal Laser Marking Machine (XHY-DP50)

XHY-DP50 Semiconductor Metal Laser Marking Machine:

Semiconductor Metal Laser Marking Machine uses Galvanometer laser marking technology and most advanced semiconductor pump laser technology, makes the YAG rod generates a mass of inverted population with 800nm wavelength semiconductor laser diode pump ND: YAG crystal, forms 1064nm wavelength giant pulse laser beam output under the effect of 0 switch, through expanding and focusing of laser beam, and finally realizes marking through controlling the deflection of galvanometer.

Semiconductor Metal Laser Marking Machine is a revolution in laser marking field. Semiconductor Metal Laser Marking Machine of laser marker features low energy consumption, high electro-optic conversion efficiency, stable laser output mode, high reliability, small size, excellent marking effect and no consumables.

The Semiconductor Metal Laser Marking Machine is designed according to ergonomics, providing beautiful appearance and simple operation. All the important optic parts are imported from Europe and America. The optics system is in fully sealed structure. Semiconductor Metal Laser Marking Machine has optics preview and focus indication function and provides reliable security for the 24-hour continuous working of the machine.

Semiconductor Metal Laser Marking Machine Application:
Carve metal and nonmetal materials. More suitable for circumstances that require super fine and high precision.

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Semiconductor Metal Laser Marking Machine is applied to electronic components, integrated circuit (IC), electric apparatus, mobile communication, hardware products, tool fittings, precision instrument, glasses, watch and clock, jewelry, automobile parts, plastic keys, construction materials, PVC pipes, medical instruments, etc.
Suitable materials include: Common metal and alloy (all metals include iron, copper, aluminum, magnesium and zinc), rare metal and alloy (gold, nickel, and titanium), metal oxide, special surface process (phosphating, aluminum anodizing and electroplated surface), ABS material (electric apparatus shell, daily necessities), ink (light-transmitting keys, printing products), epoxy resin (packages and insulating layer of electronic components).