Wells Electronic Technology Ltd.
Wells Electronic Technology Ltd.
PCB and Assembly, Purchase Components, Turnkey Solution
  • PCB and Assembly, Purchase Components, Turnkey Solution
PCB and Assembly, Purchase Components, Turnkey Solution

PCB and Assembly, Purchase Components, Turnkey Solution

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Basic Info
Basic Info
Place of Origin: Shenzhen, Guangdong, China
Payment Type: L/C, Paypal, Western Union
Product Description
Product Description

OVER 10 YEARS DIP/SMT Electronic pcb assembly Services , electronic pcba prototype assembly, OEM Electronic Manufacture Service.

One-stop electronic manufacture service, We can offer 1 to 30 Layer PCB fabrication, PCB design, PCB layout, PCB manufacturing, PCB assemblies, wire harness assembly,IC programing,components sourcing, PCBA Function Test.

Manufacture Capacity

PCB Item

Layer Counts: 1 - 30L
Base Material: FR4,High-Tg FR4,CEM1,CEM3,aluminum,High Frequency(Rogers,Taconic,Aron,PTFE,F4B)
Material Thickness(mm): 0.40, 0.60, 0.80, 1.00, 1.20, 1.50, 1.60, 2.0, 2.4, 3.2
Max Board Size: 1200mm x 500mm(48" x 20")
Board Outline Tolerance: ±0.15mm(±6mil)
Board Thickness: 0.4mm(16mil) - 3.2mm(128mil)
Thickness Tolerance: ±10%
Minimum Line/Space: 0.1mm(4mil)
Min Annular Ring: 0.1mm(4mil)
SMD Pitch: 0.3mm(12mil)
Holes
Min Hole Size: mechanical hole-0.2mm(8mil), laser hole-0.1mm(4mil)
Hole Size Tolerance: PTH: ±0.075mm(±3mil);NPTH: ±0.05mm(±2mil)
Hole Position Tolerance: ±0.075mm(±3mil)
Plating
HASL/LF: HAL2.5um(100u")
Immersion Gold/Nickel: 3-7um(120-210u") Au:0.025-0.125um(1-5u'')
Surface Finish: HAL,lead-free HAL,ENIG,Plated Gold,Immersion Gold,OSP,etc.
Copper
Copper Weight: 0.5 - 6oz
Color
Soldermask: Green, Blue, Black, White, Yellow, Red, Matt Green, Matt Black, Matt Blue
Silkscreen: White, Black, Blue,Yellow
Acceptable File Format
Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000
Certificate
ROHS,ISO9001,TS16949,UL,IPC,SGS

PCBA Item

Stencil Size/Range: 736 x 736mm(29.44 x 29.44")
Minimum IC Pitch: 0.30mm(12mil)
Maximum PCB Size: 1200 x 500mm(48 x 20")
Minimum PCB Thickness: 0.35mm(14mil)
Minimum Chip Size: 0201 (0.2 x 0.1mm)/0603 (0.6 x 0.3mm)
Maximum BGA Size: 74 x 74mm(2.96 x 2.96")
BGA Ball Pitch: 1.00mm(40mil)minimum, 3.00mm(120mil)maximum
BGA Ball Diameter: 0.40mm (16mil)minimum, 1.00mm(40mil)maximum
QFP Lead Pitch: 0.38mm(15.2mil)minimum, 2.54mm(100mil)maximum
Frequency of Stencil Cleaning: 1 time/5 to 10 pieces

If you need to get a formal quoation, please provide the spec as below:

1. PCB files in gerber file
2. Parts list(BOM list)

Welcome to contact Fulltronics team. We are here ready to assist you with our professional skills and cheerful services!
PCB and Assembly, Purchase Components, Turnkey SolutionPCB and Assembly, Purchase Components, Turnkey Solution

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