
775 Passive Heat Sink / Server Case CPU Heat Radiator
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Basic Info
Place of Origin: | Shenzhen |
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Payment Type: | T/T, Western Union |
Product Description
Product Description
1. Applied to Intel LGA775 series server case
2. Pure copper and stable performance
3. Precision Skiving technique, Reliable cooling solution.
Dimensions (L*W*H): 87mm*83mm*23mm
Noise (dB): 0 dB
Heat conducting silica gell: AD66
2. Pure copper and stable performance
3. Precision Skiving technique, Reliable cooling solution.
Dimensions (L*W*H): 87mm*83mm*23mm
Noise (dB): 0 dB
Heat conducting silica gell: AD66
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