HDI Mobile Phone PCB of 8layer Immersion Gold

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Basic Info

Place of Origin:	China
Payment Type:	L/C, T/T, D/P, Paypal, Money Gram, Western Union

Product Description

8layer HDI board/Mobile phone PCB
Material: FR4
Board Thickness: 1.2mm
Board Size: 80*120mm
Minimum Line Width/space: 3.9/3.9mil
Surface Treatment: Immersion gold
Minimum Hole Size: 8mil(0.2mm)
Impedance Control

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