Cirket Electronics Company
Cirket Electronics Company
electronics component module Printed Circuit Board Fabrication with Immersion Gold
  • electronics component module Printed Circuit Board Fabrication with Immersion Gold
electronics component module Printed Circuit Board Fabrication with Immersion Gold

electronics component module Printed Circuit Board Fabrication with Immersion Gold

Payment Type:
T/T, L/C, D/A, D/P, Western Union
Incoterm:
FOB
Min. Order:
1 Piece/Pieces
Min. Order:
1 Piece/Pieces
Delivery Time:
5 Days
Transportation:
Ocean, Land, Air
Quantity:

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Basic Info
Basic Info
Place of Origin: china
Productivity: 200000
Supply Ability: 2000000
Payment Type: T/T,L/C,D/A,D/P,Western Union
Incoterm: FOB
Certificate: UL,ISO,RoHS
Transportation: Ocean,Land,Air
Product Description
Product Description
  • Specifications:
    • Base material: FR4
    • Layer count: 2
    • Board thickness: 1.00mm
    • Copper thickness: 1oz
    • Surface finish: immersion gold
    • Solder-mask color: green
    • Sizes: 99.03 x 61.96/1up
    • Base material: FR4, aluminum, FPC and copper
    • Copper thickness: 0.5oz (minimum)
    • Copper thickness: 4oz (maximum)
    • Board thickness: 0.2mm (minimum)
    • Board thickness: 3.2mm (maximum)
    • Surface finish: HAL, ENIG, OSP, gold finger and chemistry tin
    • Possible solder mask colors: green, black, white, yellow and blue
    • Board dimension: 600 x 1,000mm
    • Hole diameter: 0.2mm (minimum)
    • Line width: 0.075mm (minimum)
    • Line spacing: 0.075mm (minimum)
    • SMT pitch: 30 degrees (minimum)
    • Annular ring: 0.05mm (minimum)
    • Aspect ratio: 11:01
    • Surface/hole plating tolerance
    • Hole tolerance (PTH): 0.25mm
    • Hole tolerance (NPTH): 0.15mm
    • SM tolerance (LPI)
    • Dimension
    • Electrically test: supported
    • RoHS marks: supported
    • Possibility of SMT device mounting: supported

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