Hong Ye Jie Technology Co,. Ltd.
Hong Ye Jie Technology Co,. Ltd.
electronic potting compound silicone rubber
  • electronic potting compound silicone rubber
electronic potting compound silicone rubber

electronic potting compound silicone rubber

Payment Type:
T/T, L/C, D/A, D/P
Incoterm:
FOB
Min. Order:
1000 Kilogram
Min. Order:
1000 Kilogram
Delivery Time:
3 Days
Transportation:
Ocean, Land, Air
Quantity:

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Basic Info
Basic Info
Place of Origin: China
Productivity: 1000t
Supply Ability: 1000t
Payment Type: T/T,L/C,D/A,D/P
Incoterm: FOB
Transportation: Ocean,Land,Air
Product Description
Product Description


Typical Application of electronic potting compound silicone rubber: HY9055

electronic potting compound silicone rubber is suitable for bonded seal of electronic components, power module and control module, which requires waterproof and insulation. It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc. Silicone Rubber Electronic Material for good elasticity is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface with materials of PC(Poly-carbonate),PP,ABS,PVC, etc. and metal materials.

Description of electronic potting compound silicone rubber:

electronic potting compound silicone rubber is a newly insulating material

silicon of silicon compounds. It cures without heat, corrosion and just with little shrinkage.

It can be applied to the sealing and pouring of various electronic components, and then forming insulation system.

Features of electronic potting compound silicone rubber:

1. No toxicity, solventless, no odor and no cure by-product.

2. Equal amount of mixing ratio, good fluidity, easy processing.

3. No significant exotherm or shrinkage during curing.


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