Shenzhen Hong Ye Jie Technology Co., Ltd.
Shenzhen Hong Ye Jie Technology Co., Ltd.
electronic potting compound silicone rubber for PCB offer
  • electronic potting compound silicone rubber for PCB offer
  • electronic potting compound silicone rubber for PCB offer
  • electronic potting compound silicone rubber for PCB offer
  • electronic potting compound silicone rubber for PCB offer
electronic potting compound silicone rubber for PCB offer
electronic potting compound silicone rubber for PCB offer
electronic potting compound silicone rubber for PCB offer
electronic potting compound silicone rubber for PCB offer

electronic potting compound silicone rubber for PCB offer

Quantity:

Your message must be between 20 to 2000 characters

Contact Now
Basic Info
Basic Info
Product Description
Product Description
  • Product Details

Basic Specification

operation way by injection or machine
sample free
hs code 3910 0000
color white/yellow/gray/red
application potting compound silicone rubber for PCB
Eco-Friendly Yes
Test Report SGS

Detail Description

Typical Application:

 

electronic potting compound silicone rubber for PCB is suitable for bonded seal of electronic components, power module and control module, which requires waterproof and insulation. It can be broadly used for LED screen, Wind Power Generator, PCB substrate, etc. Silicone Rubber Electronic Material for good elasticity is a kind of low viscosity, Inherent flame resistance, two components addtion cured potting silicone with heat-conducting. It cures with both on room temperature and heated temperature. It has the feature of the higher temperature the faster of the curing time. It can be applied to electronic components for insulation, waterproofing, fixed and flame retardant. It mainly applied in electronic components surface with materials of  PC(Poly-carbonate),PP,ABS,PVC, etc. and metal materials.

 

Description:

 

electronic potting compound silicone rubber for PCB is a newly insulating material 

silicon of silicon compounds. It cures without heat, corrosion and just with little shrinkage. 

It can be applied to the sealing and pouring of various electronic components, and then forming insulation system. 

 

Features:

 

1. No toxicity, solventless, no odor and no cure by-product.

2. Equal amount of mixing ratio, good fluidity, easy processing.

3. No significant exotherm or shrinkage during curing.

4. Flexible curing schedule, can be cured at room temperature (R.T.) or at elevated temperature.

5. Very stable to changes of temperature, stability over wide temperature range (-50 to 200 oC).

6. Good fire resistance, UL94V0 approval.

7. Excellent thermal conductivity.

8. Excellent dielectric properties for maintaining and protection of existing electrical insulation requirements.

9. Excellent weather resistance and waterproof property for protection from moisture and dust contamination.

10.Relative easier removal benefits to repair of electrical/electronic devices.

 

Picture show: 

 

 

 

Technical Parameters:

 

 

 

Before Curing

Appearence

Black/Transparent Fluid

Density(25°C  g/ml)

0.98±0.02

Viscosisty(25°Ccps)

       Part A 500±100:Part B:800±100

Mixing Ratio

A:B=1:1(By weight)

Operating Time(25°C  hr)

5

Curing time(80°C  hr)

 0.5

 

 After Curing

Hardness(Shore  A)

0-40

Dielectric Strength(KV/mm)

23

Volume Resistance(Ω.Cm)

   1.0×10 15

Permittivity(1.2MHz)

3.0

Temperature Resistence(°C)

-60~200

Fire Resistance    

  UL94-V1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 




Precaution:

1. Twelve(12) months when stored at 24C in tightly closed original packages.

2. This kind of product is non-dangerous product, which could be transported as general chemicals.

3. Storage beyond the expired date doesnot necessarily mean that the product is no longer usable. 

In this case however,the properties required for the intended use must be checked for quality assurance

reasons

 

Operation way:

1.Put part A and part B in separate container with equal dosage and stir evenly when mixing the two parts together.
2. Put the mixture into the vacuum machine under 0.08 MPa for 5 minutes.
3. The temperature influences the curing time of electronic potting silicone rubber. When in too low temperature, we suggest customers appropriately heat the mixture to accelerate vulcanization.

 

Certification:

ISO9001: HK05/01358 

SGS:GZ0606100461/CHEM

RoHS:BTRS091718751

Patent:ZL200520001597.8

 

 

Package:

 

20Kg/pail (Part A10Kg + Part B10Kg)

  

 

 

Need any help on silicone rubber, please feel free to contact Ms Kitty:

 

Tel:86-755-89948294

Mob:86-18938867593

E-mail: hyjz(at)szrl(dot)net   

Skype:kity-467707861

 

You can also send me e-mail by scanning 2 Dimensional Bar Code below:

 

 

About us:

 

 

 

 

Additional Information

Payment Terms L/C, T/T, Others
Minimum Order 100
Lead Time / Delivery Time 4 Day(s)
Sample Available YES
Delivery Details within 5 days after payment confirmed in our bank.
FOB Port Shenzhen
Loading Info By ship or by air
Packing Info 20Kg/pail as a set (Part A 10Kg + Part B 10Kg)
Target Market(s) North America, Oceania, Southeast Asia, Eastern Europe, Africa(except Middle East), Hong Kong/ Macao/ Taiwan, Latin America, Japan & Korea, Western & Southern Europe, Northern Europe, Central & Southern Asia, Middle East

Send your message to this supplier

  • Mr. Kaka

  • Enter between 20 to 4,000 characters.

Related Keywords

Related Keywords