OSP PCB

Get Latest Price

Quantity:

Your message must be between 20 to 2000 characters

Contact Now

Basic Info

Product Description

Basic Specification

Details Specifications:

Layer: 2 Layer

Vias: Buried and blind Vias

Material: FR4

Thickness: 1.6mm

Copper thickness: 35um

Mini Hole: 0.3mm

Mini Width/space: 10/10 mil

Solder Mask: LPI Green

Sickscreen: White

Application:Communication
Surface Finish: ImmOSP
Certificate: UL, ROHS,SGS, T/S16949
Short delivery time

Production Capacity

-Lead free HASL Surface finish required to meet ROHS compliant

-FR4 material with 0.2mm-3.2mm boards thickness

-Copper weight:0.5OZ,1OZ,2OZ,3OZ

-4mils track width spacing

-0.2mm min finished hole size

Welcome to HUAYANHUIHAI Electronic Co.,Ltd

PCB process

UL certificate

Oversea market

Payment Terms	T/T, L/C, Others
Minimum Order	1 PCS
Lead Time / Delivery Time	10 Day(s)
Sample Available	YES
Delivery Details	Vaccum ,Carton packing
FOB Port	Hong Kong
Loading Info	by air,by sea,or express(DHL,FEDEX,UPS)
Packing Info	<30kg/carton,standard size 362525 cm
Target Market(s)	Africa(except Middle East), Eastern Europe, Hong Kong/ Macao/ Taiwan, Japan & Korea, Latin America, Mainland China, Middle East, North America, Northern Europe, Oceania, Central & Southern Asia, Southeast Asia, Western & Southern Europe

Send your message to this supplier

Related Keywords