High Density Interconnect

Red Solder Mask 20 Layers Prototype High Density Interconnect With High Tg Material For Industrial Control

8 Layers High Density Interconnect Pab With Bga And Black Solder Mask For High-end Consumer Electronics

Green 6 Layers Immersion Gold High - Density Multilayer Pcb For Pos Device

1-28 Layers Blind & Burried Holes With High Tg High Density Interconnect For Cell Phone

8 Layers Green Solder Mask Multilayer High Density Interconnect With Controlled Impedance

Multilayer High Density Pcb Fabrication With Burried Holes For Smart Phone

Blue Solder High - Density Multilayer Pcb Board With Blind Holes For Smart Phone

14 Layer Cooper Base Multilayer High Density Interconnect With High Tg And Blind & Burried Holes

10 Layers High - Density Multilayer Pcb With Gold Immersion And Burried And Blind Vias

8 Layer Fr4 Immersion Gold 0.1mm Vias Hdi Multilayer High Density Interconnect

Green 8 Layers High - Density Multilayer High Density Interconnect Pcb With Bga Solder

Immersion Gold Multilayers High - Density Multilayer Pcb For Phone Call Main Board