CHINAFIX CF280T SMD intelligent BGA chips soldering machine

CHINAFIX CF280T SMD intelligent BGA chips soldering machine

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Payment Type:: Western Union

Incoterm:: FOB

Min. Order:: 1 Set/Sets

Min. Order:: 1 Set/Sets

Delivery Time:: 7 Days

Transportation:: Ocean, Land, Air

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Basic Info

Place of Origin:	Guangdong
Productivity:	20/week
Payment Type:	Western Union
Incoterm:	FOB
Certificate:	CE ROSH
Transportation:	Ocean,Land,Air

Product Description

CF280T Working Parameter

Model	Chinafix CF280T
Solder Type	Leaded/Lead Free
SMD Type	Micro BGA,BGA,CSP,QFP
PCB Thickness	0.5~4mm
PCB Size	W50D50~W440D310mm
Heating Mode/Power(Upper)	Hot-blast air /800W
Heating Mode/Power(Bottom)	Hot-blast air /800W
Preheating Mode/Power	IR /2200W
PCB Location Mode	Shape or Tongs
Driver Mode	Gear,Rack
Control/Adjusting Mode	Touch Screen + PLC
Temperature Range	Room Temperature 0~400°C
Max Power	3800W
Supply Voltage	110V/220V
Machine Dimension	720mm(L) * 700mm(W) * 570mm(H)
Machine Weight	28KG

CF280T characteristic:
1, Touch-screen+PLC, precise temperature control, being operate easily
2, The hot-air part adopts exported long-life heating coil, through special insulation heating treatment, heating uniformly, long-life to use well.

3, The design of three warm areas' support, can fine adjust to support height, avoid welding-area to sink.
4, Upper and bottom hot-air control temperature separately, it can store 50 items with 16 stages temperature curve setting-up.

5, Overtemperature protection function,over the temperature, heating coil automatic power off.

6, Intelligent mute function, keep mute under non-working condition.

7, New type design of air outlet with mixed wind, air-out temperature uniformly.

8, Machincal part adopts oxidation treatment, main machine box use thicken material, prevent shapeless at whole hog.

9, Upper heating part continues to use high-grade products' design of move by X/Y shaft, treating all kinds of shapeless chips easier.

10, Three warm areas can be controlled separated, to achieve the function of soldering and drying.
11, Complete machine construction adopts the only design of dismounting easily, exchange electric parts simply and conveniently, warranty with fast speed, machine's rate of utilization reaches the highest.
12, Allocate vacuum attaching-pen, take down chips easily.

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Related Keywords

BGA Chips Soldering Machine , BGA Chips Soldering Machine , BGA Servicing Consumable Items