
HOT SALE CHINAFIX CF160 infrared BGA soldering station
- Payment Type:
- Western Union
- Incoterm:
- FOB
- Min. Order:
- 1 Set/Sets
- Min. Order:
- 1 Set/Sets
- Delivery Time:
- 7 Days
- Transportation:
- Ocean, Land, Air
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Contact NowPlace of Origin: | Guangdong |
---|---|
Productivity: | 20/week |
Payment Type: | Western Union |
Incoterm: | FOB |
Certificate: | CE ROSH |
Transportation: | Ocean,Land,Air |
Functional Parameter
Basic Standard |
|
Power supply |
AC 220V/50-60HZ |
Heating Method |
Two-side infrared heating |
Demension |
Lmm360*Wmm520*H430mm |
Maximum Power |
2.3KW |
PCB size |
405mm*310mm |
Temperature Control Method |
|
Heating controlled independently |
Yes |
Upper heating control method |
High-precision closed-loop control, instrument error is about 0.5% |
Upper temperature control and measuring method |
High sensitivity temperature sensor, temperature monitoring indirectly.(monitor temperature of heater element) |
Bottom heating control method |
High-precision closed-loop control, instrument error is about 0.5% |
Bottom temperature control and measuring method |
High sensitivity temperature sensor, temperature monitoring indirectly. (monitor temperature of heater element) |
Rework station Function |
|
Application type |
Be suitable for welding,sealing-off or repairing BGA,PBGA,CSP on different PCB and more kinds of encapsulation mode component, all suitable for lead or lead-free soldering. |
Suitable chip size |
less than 50mm |
Other Performances |
|
Standby Protection |
Yes |
Auxiliary lighting |
Yes |
Features:
In the continuous exploration and practice, we make clear our R&D policy gradually, and we think that BGA rework machine required by users should equipped with below four characteristics:
1.High success rate: high success rate of welding can reduce user's cost, otherwise low success rate will increase user's loss greatly, which is very important for maintenance industry.
3.Easy to operate: it can make users master of operation method as soon as possible and save operation time directly, thus improving working efficiency.
4.Applicability: due to the type and size of electronic components with BGA packaging technique are various and will be more and more kinds, PCB board's size and quality are different greatly, so the applicability is necessary. If machine's range of application is narrow, then it will be hard to meet the requirements of electronic products rapid development.
All of models of machine having been produced by our company at present, the success rate,reliability and other areas have been widely recognized by users, and with the development of production in the future, we will study user's feedback carefully and never stop improving our product, so that it can meet more user's requirements.
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