Bare Pcb For Mobile Phone Motherboard

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Basic Info

Product Description

Advanced ProductionEquipment
electronic PCB manufacturer and pcb assembly

Product HighQuality Perfect
electronic PCB manufacturer and pcb assembly

Our deliverytime:

1.About Factory:

Experience: we have 20 years experinecsin circuit board manufacturing,with 50 employees and 60 excellent engineers,covering an area of 13000 square meters.Monthly capability is more than 5000square meters, 4500 types/month. we cooperate with some well-known enterprises,such as Panasonic, HP,Honeywell and so on.

2.Good after sales service:

anything wrong happening in our products willbe solved within 2 hours. we always offer relative technical support/consultant.Quick response. all your inquiry will be replied within 24 hours.

3.Ourproducts and service are sold well in North America,West Europe, Japan,Singpore, Malaysia and other countries.
electronic PCB manufacturer and pcb assembly

Meet your need is ourgreatest pursuit .If you are looking for a pcb board manufacturerinchina,Pleasegive us your files ofpcb for a quote (Gerberfiles and specification),I will reply email in 3hours. Youalso cancontact usby .

1.Advanced production lines andprofessional staff.

2.Honesty credibility in china'stop.

3.Competest price but highquality.

4. One-stopservice.

5.Delivery ontime.
electronic PCB manufacturer and pcb assembly

NO

         Item

       Craft Capacity

1

Layer

1-30 Layers

2

Base Material for PCB

FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material

3

Rang of finish baords Thickness

0.21-7.0mm

4

Max size of finish board

900MM*900MM

5

Minimum Linewidth

3mil (0.075mm)

6

Minimum Line space

3mil (0.075mm)

7

Min space between pad to pad

3mil (0.075mm)

8

Minimum hole diameter

0.10 mm

9

Min bonding pad diameter

10mil

10

Max proportion of drilling hole and board thickness

1:12.5

11

Minimum linewidth of Idents

4mil

12

Min Height of Idents

25mil

13

Finishing Treatment

HASL (Tin-Lead Free),  ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.

14

Soldermask

Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask.

15

Minimun thickness of soldermask

10um

16

Color of silk-screen

White, Black, Yellow ect.

17

E-Testing

100% E-Testing (High Voltage Testing);  Flying Probe Testing

18

Other test

ImpedanceTesting,Resistance Testing, Microsection etc.,

19

Date file format

GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++

20

Special technological requirement

Blind & Buried Vias and High Thickness copper

21

Thickness of Copper

0.5-14oz (18-490um)

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NO	Item	Craft Capacity
1	Layer	1-30 Layers
2	Base Material for PCB	FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material
3	Rang of finish baords Thickness	0.21-7.0mm
4	Max size of finish board	900MM*900MM
5	Minimum Linewidth	3mil (0.075mm)
6	Minimum Line space	3mil (0.075mm)
7	Min space between pad to pad	3mil (0.075mm)
8	Minimum hole diameter	0.10 mm
9	Min bonding pad diameter	10mil
10	Max proportion of drilling hole and board thickness	1:12.5
11	Minimum linewidth of Idents	4mil
12	Min Height of Idents	25mil
13	Finishing Treatment	HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc.
14	Soldermask	Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask.
15	Minimun thickness of soldermask	10um
16	Color of silk-screen	White, Black, Yellow ect.
17	E-Testing	100% E-Testing (High Voltage Testing); Flying Probe Testing
18	Other test	ImpedanceTesting,Resistance Testing, Microsection etc.,
19	Date file format	GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++
20	Special technological requirement	Blind & Buried Vias and High Thickness copper
21	Thickness of Copper	0.5-14oz (18-490um)