Shenzhen Tianweisheng Electronic Co., Ltd.
Shenzhen Tianweisheng Electronic Co., Ltd.
High Quality Peelable Mask Pcb 
  • High Quality Peelable Mask Pcb 
  • High Quality Peelable Mask Pcb 
  • High Quality Peelable Mask Pcb 
  • High Quality Peelable Mask Pcb 
  • High Quality Peelable Mask Pcb 
High Quality Peelable Mask Pcb 
High Quality Peelable Mask Pcb 
High Quality Peelable Mask Pcb 
High Quality Peelable Mask Pcb 
High Quality Peelable Mask Pcb 

High Quality Peelable Mask Pcb 

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Basic Info
Basic Info
Product Description
Product Description
 
Specifications
1.High Quality Peelable Mask PCB
2.Reputablemanufacturer
3.10 years of experience in PCB
4.Quick delivery
5.OEMService
Product: High Quality Peelable Mask PCB
1.Specification:
  • High quality PCB with gooddesign      
  • 10 years of experience inPCB        
  • Reputablemanufacturer                             
  • RoHS/ ULCertificated                
  • Competitive price                   
  • Quickdelivery                      
  • OEMService     
    2. ProductAttributes:
    Technology Project
    Productivity &Technology Standards
    Certificate
    ISO9001,ISO14001,UL
    SurfaceFinishing
    Plating Nickeland immersion Gold, Hot Air (HASL), HASL Lead Free, OSP, ImmersionTin
    Max.panelsize
    600mm*700mm
    Min.panelsize
    5mm*5mm
    Board warpage
    singleside<=1.0%
    doubleside<=0.6%
    multi-layer<=0.6%
    Min.Thickness
    0.2mm±0.08mm
    Min.Linewidth
    HASL board0.07mm±20%(2mil±20%)
    Min.linespace
    immersion Gold0.075mm±20%(2mil±20%)
    copperfoil toboard sidespacing
    0.5mm
    hole sidetolinesidespacing
    0.3mm
    Min holesize
    0.2mm
    copperthinckness of Hole
    20-35um
    Tooling holetolerance
    ±0.076mm
    Min.stampinground hole diameter
    FR-4 boardthinckness 1.0mm(40mil)under 1.0mm(40mil)
    Min.stampinground hole diameter
    FR-4 boardthinckness 1.2-3.0mm(47mil-120mil)1.5mm(59mil)
    Min.stampingsquare hole specification
    FR-4.CEM-3board thinckness 1.0mm(40mil) under 0.8mm x 0.8mm(31.5mil x31.5mil)
    Min.stampingsquare hole specification
    FR-4.CEM-3board thinckness 1.2mm - 3.0mm(47mil-120mil) 1.0mm x 1.0mm(40mil x40mil)
    trace deviation
    ±0.076mm(±3mil)
    Molding sizetolerancelimit
    CNC millingprofile ±0.15mm(±6mil); die profile ±0.15mm(±6mil)
    V-CUTregistration accuracy
    ±0.2mm(±8mil)
    product type
    single side double side multi-layer and flexible board
    BaseMaterial
    FR-4,CEM-1,CEM-3, High frequency, aluminium based board
    process thinckness
    0.2-3.5mm
    base material copperthinckness
    18um, 35um,70um, 105 um
    Min.holddiameter
    0.2mm
    plating thinckness
    plating goldNi2.5-5um, Au0.05-0.10um
    plating thinckness
    immersion goldNi5-8um, Au0.08-0.12um
    plating thinckness
    finger goldNi2.5-5um, Au0.05-0.12um
    process ability
    20000 squaremeters/month
    profile process
    die CNCmachine
    V-CUT horn tolerance
    ±5°
    V-CUT boardmaterialthinckness
    0.6mm - 3.2mm (15.5mil -129.58mil)
    Min.SMDspace
    0.3mm(12mil)
    Min.componentmarkingfont
    0.15mm(5.79mil)
    Min. singleside solder annular width(production)
    0.15mm(5.79mil)
    Min.cross-hatchingpad
    0.076mm(0.3mil)
    Min.soldermaskbrigde
    ±0.076mm(±3mil)
    Carboninkboard making data
    1)1.0 highimpedance control limit:20K±10%
    2)2.0hardness:6H
    3)3.0 can bearfriction time:over 200000
    3. Material:
    • FR-4(130TG-180TG)
    • CEM-1
    • Aluminum Based
    • ISOLA
    • ARLON
    • TACONIC

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