10-layer Multilayer Hdi Pcb
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Contact NowBasic Info
Basic Info
Product Description
Product Description
Material:FR4/94vo/CEM-1/CEM-3
Layers: 8L
Thickness:1.6MM
Goldthickness:1 um
Surface finish: Gold plating /commersion gold/HASL/OSP
Surface finish: Gold plating /commersion gold/HASL/OSP
LineWidth/Space: 8mil/8mil
Solder Mask Color: Green
Solder Mask Color: Green
NO |
Item |
Craft Capacity |
1 |
Layer |
1-28 Layers |
2 |
Base Material for PCB |
FR4, CEM-1, TACONIC, Aluminium, High Tg Material, High Frequence ROGERS ,TEFLON, ARLON, Halogen-free Material |
3 |
Rang of finish baords Thickness |
0.21-7.0mm |
4 |
Max size of finish board |
900MM*900MM |
5 |
Minimum Linewidth |
3mil (0.075mm) |
6 |
Minimum Line space |
3mil (0.075mm) |
7 |
Min space between pad to pad |
3mil (0.075mm) |
8 |
Minimum hole diameter |
0.10 mm |
9 |
Min bonding pad diameter |
10mil |
10 |
Max proportion of drilling hole and board thickness |
1:12.5 |
11 |
Minimum linewidth of Idents |
4mil |
12 |
Min Height of Idents |
25mil |
13 |
Finishing Treatment |
HASL (Tin-Lead Free), ENIG(Immersion Gold), Immersion Silver , Gold Plating (Flash Gold), OSP, etc. |
14 |
Soldermask |
Green, White, Red, Yellow, Black, Blue, transparent photosensitive soldermask, Strippable soldermask. |
15 |
Minimun thickness of soldermask |
10um |
16 |
Color of silk-screen |
White, Black, Yellow ect. |
17 |
E-Testing |
100% E-Testing (High Voltage Testing); Flying Probe Testing |
18 |
Other test |
ImpedanceTesting,Resistance Testing, Microsection etc., |
19 |
Date file format |
GERBER FILE and DRILLING FILE, PROTEL SERIES, PADS2000 SERIES, Powerpcb SERIES, ODB++ |
20 |
Special technological requirement |
Blind & Buried Vias and High Thickness copper |
21 |
Thickness of Copper |
0.5-14oz (18-490um) |
Tks for you looking, hope you have a greatday!
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