Low Price Xbox360 Controller Board
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Basic Info
Product Description
Product Description
led double sided pcb
LED DOUBLE SIDES PCB
1.Single,double Layer PCB
2.MultilayerPCB/HDI PCB (4L to 28Layers)
3.FlexiblePCB/Rigid Flexible PCB (single, double and 4Layers)
4.AluminumPCB
5.Componentssourcing and purchasing
7.6.FinalPCB and FPC assembly: SMT & PTH & BGA
8.Customclearance for material importing and product exporting
9.Test:AOI, In-Circuit Test (ICT), Functional Test (FCT)
Advantage
1.Automatedequipments to reduce the cost,
2.Our pricesare very competitive and quality is super
3.Fastaction/24hours quotation
4.Quickprototyping and production
5.Steadyand safe delivery to Russia by EMS, air or sea.
Major PCB parameters below canall be customised:
1) Layers, size,thickness
2) Base material :FR4,CEM3
3) Solder mask: Red,Green,Yellow,Blue or others
4) Characters:White(default)or others
5) Surface technique: Tinsoldering, plating gold, immersion gold,OSP
If you need to get a formal quoation,please providethe spec as below:
PCB files ingerber file, .pcb or .pcb doc formart ,specification and BOM
PCB Capacity
PCB Capacity
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technologyproject
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making ability and technologystandard
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Certificate
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UL, RoHS, SGS
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Surface Finishing
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Plating Nickel and immersion Gold, Hot Air (HASL), HASL Lead Free,OSP, Immersion Tin
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Max.panel size
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600mm*700mm
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Min.panel size
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5mm*5mm
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Boardwarpage
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single side<=1.0%
double side<=0.6%
multi-layer<=0.6%
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Min.Thickness
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0.2mm±0.08mm
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Min.Line width
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HASL board 0.07mm±20%(2mil±20%)
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Min.line space
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immersion Gold 0.075mm±20%(2mil±20%)
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copperfoil to board sidespacing
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0.5mm
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hole sideto linesidespacing
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0.3mm
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Min hole size
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0.2mm
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copper thinckness of Hole
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20-35um
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Tooling hole tolerance
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±0.076mm
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Min.stamping round hole diameter
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FR-4 board thinckness 1.0mm(40mil)under 1.0mm(40mil)
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Min.stamping round hole diameter
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FR-4 board thinckness1.2-3.0mm(47mil-120mil)1.5mm(59mil)
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Min.stamping square hole specification
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FR-4.CEM-3 board thinckness 1.0mm(40mil) under 0.8mm x0.8mm(31.5mil x 31.5mil)
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Min.stamping square hole specification
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FR-4.CEM-3 board thinckness 1.2mm - 3.0mm(47mil-120mil) 1.0mm x1.0mm(40mil x 40mil)
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tracedeviation
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±0.076mm(±3mil)
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Molding size tolerancelimit
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CNC milling profile ±0.15mm(±6mil); die profile±0.15mm(±6mil)
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V-CUT registration accuracy
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±0.2mm(±8mil)
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producttype
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single sidedouble side multi-layer and flexibleboard
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Base Material
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FR-4,CEM-1, CEM-3, High frequency, aluminium basedboard
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processthinckness
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0.2-3.5mm
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base materialcopperthinckness
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18um, 35um, 70um, 105 um
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Min.hold diameter
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0.2mm
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platingthinckness
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plating gold Ni2.5-5um, Au0.05-0.10um
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platingthinckness
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immersion gold Ni5-8um, Au0.08-0.12um
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platingthinckness
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finger gold Ni2.5-5um, Au0.05-0.12um
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processability
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20000 square meters/month
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profileprocess
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die CNC machine
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V-CUT horntolerance
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±5°
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V-CUT board materialthinckness
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0.6mm - 3.2mm (15.5mil - 129.58mil)
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Min.SMD space
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0.3mm (12mil)
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Min.component markingfont
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0.15mm (5.79mil)
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Min. single side solder annular width(production)
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0.15mm (5.79mil)
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Min. cross-hatchingpad
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0.076mm (0.3mil)
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Min.soldermask brigde
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±0.076mm(±3mil)
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Carbonink board making data
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1)1.0 high impedance control limit:20K±10%
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2)2.0 hardness:6H
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3)3.0 can bear friction time:over 200000
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PCBA assemblecapability
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Quantity
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Prototype&LowVolume PCB Assembly,from 1 Board to 250,is specialty,or up to1000
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Typeof Assembly
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SMT,Thru-hole
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SolderType
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WaterSoluble Solder Paste,Leaded and Lead-Free
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Components
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PassiveDown to 0201 size
BGAand VFBGA
LeadlessChip Carriers/CSP
Double-sidedSMT Assembly
FinePitch to 0.8mils
BGARepair and Reball
PartRemoval and Replacement
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BareBoard Size
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Smallest:0.25*0.25inches
Largest:20*20inches
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FileFormate
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Billof Materials
Gerberfiles
Pick-N-Placefile
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Typesof Service
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Turn-key,partialturn-key or consignment
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Componentpackaging
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CutTape,Tube,Reels,Loose Parts
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TurnTime
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Sameday service to 15 days service
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Testing
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FlyingProbe Test,X-ray Inspection AOI Test
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LED DOUBLE SIDES PCB
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